Patents by Inventor Eunji KO

Eunji KO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Organic Light Emitting Diode Employing Multi-Refractive Capping Layer For Improving Light Efficiency
    Publication number: 20220093899
    Abstract: The present invention relates to an organic light emitting diode which complexly includes capping layers having different refractive indexes to improve light extraction efficiency, reduce a driving voltage, and improve current efficiency.
    Type: Application
    Filed: September 9, 2021
    Publication date: March 24, 2022
    Applicant: P&H TECH Co., Ltd
    Inventors: Seo-Yong HYUN, Seok-Keun YOON, Do Yeol YOON, Eunji KO
  • Organic Light Emitting Diode Employing Low-Refractive Capping Layer For Improving Light Efficiency
    Publication number: 20220085336
    Abstract: The present invention relates to an organic light emitting diode which includes a capping layer with a low refractive index to improve light extraction efficiency, thereby reducing a driving voltage, improving power efficiency, and improving current efficiency.
    Type: Application
    Filed: September 9, 2021
    Publication date: March 17, 2022
    Applicant: P&H TECH Co., Ltd
    Inventors: Seo-Yong HYUN, Seok-Keun YOON, Do Yeol YOON, Eunji KO
  • Composite conductive substrate and manufacturing method thereof
    Patent number: 11089678
    Abstract: The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: August 10, 2021
    Assignee: Korea Electronics Technology Institute
    Inventors: Chuljong Han, Minsuk Oh, Eunji Ko, Hongseon Park
  • COMPOSITE CONDUCTIVE SUBSTRATE AND MANUFACTURING METHOD THEREOF
    Publication number: 20200253046
    Abstract: The present disclosure provides a composite conductive substrate exhibiting enhanced properties both in the folding endurance and the electric conductivity and a method of manufacturing the composite conductive substrate. A composite conductive substrate according to an exemplary embodiment of the present disclosure includes: an insulating layer; a metal nanowire structure embedded beneath one surface of the insulating layer; and a metal thin film coupled to the metal nanowire structure. The composite conductive substrate may be fabricated in an order of the insulating film, the metal nanowire structure, and the metal thin film, or vice versa.
    Type: Application
    Filed: January 31, 2019
    Publication date: August 6, 2020
    Applicant: KOREA ELECTRONICS TECHNOLOGY INSTITUTE
    Inventors: Chuljong HAN, Minsuk OH, Eunji KO, Hongseon PARK