Patents by Inventor Eunkyeom KIM

Eunkyeom KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cover wafer and method of cleaning substrate processing apparatus including the same
    Patent number: 12712164
    Abstract: A method of cleaning a substrate processing apparatus that provides a processing space for accommodating a process wafer and includes a substrate support including an internal electrode, the method includes disposing a cover wafer on an upper surface of the substrate support; fixing the cover wafer to the substrate support using the internal electrode of the substrate support; plasma cleaning the processing space; and removing a current of the internal electrode and removing the cover wafer, wherein the cover wafer includes silicon carbide (SiC), a lower surface of the cover wafer is in contact with the substrate support, and an average roughness of an upper surface of the cover wafer is less than an average roughness of an upper surface of the process wafer.
    Type: Grant
    Filed: November 21, 2023
    Date of Patent: August 18, 2026
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Doyoung Kim, Seungkyu Lim, Nohsung Kwak, Minkyu Park, Daegyu Lim, Eunkyeom Kim, Hyeonggyu Kim, Taemin Park, Wonbo Shim, Sungjun Ann, Jinwoo Jung
  • WAFER TRANSFER APPARATUS
    Publication number: 20250273504
    Abstract: A wafer transfer apparatus includes a blade having a wafer accommodation area configured to support a wafer, a minimum contact area (MCA) support on the wafer accommodation area of the blade, a plurality of microstructures on an upper surface of the MCA support, each of the plurality of microstructures having an upper end configured to be a contact area for contacting the wafer, and a porous adsorption material between the plurality of microstructures, the porous adsorption material having a level lower than that of the contact area.
    Type: Application
    Filed: December 3, 2024
    Publication date: August 28, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seungkyu LIM, Taeyang HAN, Joowon KANG, Dasol KIM, Eunkyeom KIM, Changwoo SONG
  • COVER WAFER AND METHOD OF CLEANING SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
    Publication number: 20240203710
    Abstract: A method of cleaning a substrate processing apparatus that provides a processing space for accommodating a process wafer and includes a substrate support including an internal electrode, the method includes disposing a cover wafer on an upper surface of the substrate support; fixing the cover wafer to the substrate support using the internal electrode of the substrate support; plasma cleaning the processing space; and removing a current of the internal electrode and removing the cover wafer, wherein the cover wafer includes silicon carbide (SiC), a lower surface of the cover wafer is in contact with the substrate support, and an average roughness of an upper surface of the cover wafer is less than an average roughness of an upper surface of the process wafer.
    Type: Application
    Filed: November 21, 2023
    Publication date: June 20, 2024
    Inventors: Doyoung KIM, Seungkyu LIM, Nohsung KWAK, Minkyu PARK, Daegyu LIM, Eunkyeom KIM, Hyeonggyu KIM, Taemin PARK, Wonbo SHIM, Sungjun ANN, Jinwoo Jung