Abstract: The present invention relates to a plant-based COVID-19 variant recombinant spike protein expression vector, and a recombinant protein using the expression vector, wherein a plant expression system is used such that the recombinant protein does not have the disadvantages of animal-derived recombinant proteins and exhibits an excellent SARS coronavirus 2 prevention and treatment effect, and thus can be effectively utilized as a safe composition for preventing and treating COVID-19.

Abstract: The present invention relates to a method for preparing dough for frozen pizza, dough for frozen pizza prepared by the preparation method, and frozen pizza comprising the same.

Abstract: A semiconductor package includes a substrate. A first semiconductor chip is disposed on the substrate and is electrically connected to the substrate. The first semiconductor chip comprises a first sidewall extending in a first direction, a second sidewall extending in a second direction that crosses the first direction, and a third sidewall disposed between the first sidewall and the second sidewall and configured to connect the first sidewall and the second sidewall. The third sidewall has a curved surface shape. A second semiconductor chip is disposed on the first semiconductor chip and is electrically connected to the first semiconductor chip.

Abstract: A semiconductor package includes a substrate. A first semiconductor chip is disposed on the substrate and is electrically connected to the substrate. The first semiconductor chip comprises a first sidewall extending in a first direction, a second sidewall extending in a second direction that crosses the first direction, and a third sidewall disposed between the first sidewall and the second sidewall and configured to connect the first sidewall and the second side wall. The third sidewall has a curved surface shape. A second semiconductor chip is disposed on the first semiconductor chip and is electrically connected to the first semiconductor chip.

Abstract: Provided is a sign language recognition system, and the sign language recognition system includes an acquisition unit configured to acquire an electromyogram signal of a user from a sensor measurement device worn around an arm of the user, an extraction unit configured to extract a muscle active section from the electromyogram signal to detect a sign language gesture of the user, a producing unit configured to produce a first feature vector by performing signal processing to the muscle active section, a search unit configured to search a signal corresponding to the first feature vector in a database, and an output unit configured to output a text corresponding to the searched signal.

Abstract: Provided is a sign language recognition system, and the sign language recognition system includes an acquisition unit configured to acquire an electromyogram signal of a user from a sensor measurement device worn around an arm of the user, an extraction unit configured to extract a muscle active section from the electromyogram signal to detect a sign language gesture of the user, a producing unit configured to produce a first feature vector by performing signal processing to the muscle active section, a search unit configured to search a signal corresponding to the first feature vector in a database, and an output unit configured to output a text corresponding to the searched signal.

Abstract: A hydrogel composition includes 0.1 to 10 wt % of a cross-linking agent, 0.2 to 6 wt % of a gelling polymer, 0.5 to 20 wt % of a polyhydric alcohol, and 70 to 90 wt % of purified water to maintain a form without a supporter, be stable without fluidization even when a hydrogel is immersed in cosmetics or pharmaceuticals, and allow the cosmetics or the pharmaceuticals to be uniformly delivered to skin.

Abstract: The present disclosure relates to a biomarker for predicting the sensitivity to a protein kinase inhibitor and a use thereof. The present disclosure provides a marker, a composition, and a kit for predicting the sensitivity to a protein kinase inhibitor, and a prediction method thereof. According to the present disclosure, the marker has an excellent effect of predicting the sensitivity to a protein kinase inhibitor, and thus the present disclosure can be useful for cancer treatment.

Abstract: A semiconductor package having an upper surface, a lower surface, and at least one side surface is provided. The semiconductor package includes a mold member disposed on the upper surface and at least one side surface of a semiconductor chip included in the semiconductor package. A marking pattern in the semiconductor package having information about the semiconductor chip is formed on at least one side surface of the mold member.

Abstract: There is provided an oil-in-water type organogel cosmetic composition having variable transparency, including 0.05% by weight to 50.00% by weight of an oil phase portion, and 50% by weight to 99.95% by weight of a water phase portion on the basis of total weight, wherein the oil phase portion and the water phase portion has a difference in refractive indices within a range of 0.03 to 0.16. The organogel cosmetic composition may be usefully utilized because the composition not only has high formulation stability according to temperature and time, but also enables an optimal application time to be easily determined with the naked eye by controlling the contents of components contained in the water phase portion and the oil phase portion in such a manner that the color of the composition may be changed from opaque ivory white color to transparent color when the composition is applied to skin.

Abstract: The present invention relates to a sticky hydrogel cosmetic composition. According to the present invention, the sticky hydrogel cosmetic composition containing 0.1 to 1 wt % of sodium polyacrylate having an Na substitution degree of at least 50% as a hydrophilic polymer forms hydrogel containing a sufficient amount of a sticky mucilaginous substance while having excellent stability in formulation. Therefore, the present invention has excellent adhesiveness when applied to the skin, thereby allowing the absorption of moisture and ingredients into the skin to be maximized. Thus, the present invention can be widely used for the development of various cosmetics such as a mask pack.

Abstract: A semiconductor package includes a first semiconductor chip, a second semiconductor chip and a sealing member. The first semiconductor chip includes a substrate having a first surface and a second surface opposite to the first surface and having an opening that extends in a predetermined depth from the second surface, and a plurality of through electrodes extending in a thickness direction from the first surface, end portions of the through electrodes being exposed through a bottom surface of the opening. The second semiconductor chip is received in the opening and mounted on the bottom surface of the opening. The sealing member covers the second semiconductor chip in the opening.

Abstract: Provided are a semiconductor package and a method of fabricating the same. In one embodiment, to fabricate a semiconductor package, a wafer having semiconductor chips fabricated therein is provided. A heat sink layer is formed over the wafer. The heat sink layer contacts top surfaces of the semiconductor chips. Thereafter, the plurality of semiconductor chips are singulated from the wafer.

Abstract: Semiconductor packages including a heat spreader and methods of forming the same are provided. The semiconductor packages may include a first semiconductor chip, a second semiconductor chip, and a heat spreader stacked sequentially. The semiconductor packages may also include a thermal interface material (TIM) layer surrounding the second semiconductor chip and directly contacting a sidewall of the second semiconductor chip. An upper surface of the TIM layer may directly contact a lower surface of the heat spreader, and a sidewall of the TIM layer may be substantially coplanar with a sidewall of the heat spreader. In some embodiments, a sidewall of the first semiconductor chip may be substantially coplanar with the sidewall of the TIM layer.

Abstract: A semiconductor package includes a heat spreader. The semiconductor package includes a substrate, a first semiconductor chip disposed on the substrate, and a second semiconductor chip disposed on the first semiconductor chip. The heat spreader may be formed on the first semiconductor chip. A thermal interfacial material (TIM) layer may be formed to be in contact with the first semiconductor chip and the heat spreader and may cover side surfaces of the second semiconductor chip. Heat generated by the first semiconductor chip may be emitted through the TIM layer and the heat spreader. Thermal stress caused by a difference in coefficients of thermal expansion (CTEs) between the substrate and the first semiconductor chip may be distributed to ensure structural stability.

Abstract: Disclosed is a method for producing graphene functionalized at its edge positions of graphite. Organic material having one or more functional groups is reacted with graphite in reaction medium comprising methanesulfonic acid and phosphorus pentoxide, or in reaction medium comprising trifluoromethanesulfonic acid, to produce graphene having organic material fuctionalized at edges. And then, high purity and large scaled graphene and film can be obtained by dispersing, centrifugal separating the functionalized graphene in a solvent and reducing, in particular heat treating the graphene. According to the present invention graphene can be produced inexpensively in a large amount with a minimum loss of graphite. (FIG.

Abstract: A method of fabricating a wafer level package includes preparing a wafer including a plurality of first semiconductor chips, mounting a plurality of second semiconductor chips on the wafer, disposing the wafer on a lower mold and disposing an upper mold so as to surround edges of a top surface of the wafer, dispensing a molding member on the wafer, and pressurizing the molding member by using a plunger so as to fabricate a wafer level package in which a top surface of each of the plurality of second semiconductor chips is exposed.

Abstract: Provided are a semiconductor package and a method of fabricating the same. In one embodiment, to fabricate a semiconductor package, a wafer having semiconductor chips fabricated therein is provided. A heat sink layer is formed over the wafer. The heat sink layer contacts top surfaces of the semiconductor chips. Thereafter, the plurality of semiconductor chips are singulated from the wafer.

Abstract: Semiconductor packages including a heat spreader and methods of forming the same are provided. The semiconductor packages may include a first semiconductor chip, a second semiconductor chip, and a heat spreader stacked sequentially. The semiconductor packages may also include a thermal interface material (TIM) layer surrounding the second semiconductor chip and directly contacting a sidewall of the second semiconductor chip. An upper surface of the TIM layer may directly contact a lower surface of the heat spreader, and a sidewall of the TIM layer may be substantially coplanar with a sidewall of the heat spreader. In some embodiments, a sidewall of the first semiconductor chip may be substantially coplanar with the sidewall of the TIM layer.

Abstract: The present invention relates to an emulsified hydrogel composition and to a production method therefor, wherein, by incorporating between 20 and 30 percent by weight of a gelling solution and an emulsion obtained by mixing between 45 and 60 percent by weight of an aqueous component and between 15 and 30 percent by weight of an oil component, it is possible to simultaneously provide the skin with an aqueous fraction and an oil fraction, and it is possible to enhance functionality due to the inclusion of a high content of a dermatologically active component dissolved in the oil component.