Abstract: A core-shell quantum dot including a core including a first semiconductor nanocrystal, the first semiconductor nanocrystal including zinc, tellurium, and selenium and a semiconductor nanocrystal shell disposed on the core, the semiconductor nanocrystal shell including zinc and selenium, sulfur, or a combination thereof and a production thereof are disclosed, wherein the core-shell quantum dot does not include cadmium, lead, mercury, or a combination thereof, wherein the core-shell quantum dot(s) includes chlorine, wherein in the core-shell quantum dot, a mole ratio of chlorine with respect to tellurium is greater than or equal to about 0.01:1 and wherein a quantum efficiency of the core-shell quantum dot is greater than or equal to about 10%.

Abstract: A curable silicone composition is provided. The curable silicone composition comprises a cadmium-free quantum dot in an amount of from about 0.01 to about 10 mass % of the composition, wherein the composition can be cured by a hydrosilylation reaction and has at least about 10 mol % of aryl groups in all silicon atom-bonded organic groups. The curable silicone composition exhibits excellent dispersibility of the quantum dot, and cures to form a cured product exhibiting excellent color conversion efficiency.

Abstract: Disclosed is an aluminum-polymer resin composite. The composite includes i) aluminum and ii) a polymer resin bonded to the aluminum after modification of the aluminum surface with at least one surface modifier selected from the group consisting of sulfur-containing diazole derivatives, sulfur-containing diamine derivatives, sulfur-containing thiol derivatives, sulfur-containing pyrimidine derivatives, and sulfur-containing silane coupling agents. The intensity ratios of C/Al, N/Al, O/Al, Na/Al, Si/Al, and S/Al in the composite are in the range of 9.75×10?6 to 9.5×10?1 at depths of 100 nm to 500 nm, as analyzed by secondary ion mass spectrometry (SIMS). The composite has improved adhesive strength between the metal and the resin while maintaining its tensile strength and air tightness even after thermal shock testing.