Patents by Inventor Eunseok Cho
Eunseok Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11972831Abstract: A receiver that receives a multi-level signal includes a pre-amplifier circuit, a slicer circuit and a decoder circuit. The pre-amplifier circuit generates a plurality of intermediate data signals based on an input data signal and a plurality of reference voltages. The slicer circuit generates a plurality of decision signals based on the plurality of intermediate data signals and a clock signal. The decoder circuit generates output data based on the plurality of decision signals. The pre-amplifier circuit includes a first circuit and a second circuit. The first circuit generates one of the plurality of intermediate data signals based on the input data signal and one of the plurality of reference voltages, and has a first structure. The second circuit generates another one of the plurality of intermediate data signals based on the input data signal and another one of the plurality of reference voltages, and has a second structure different from the first structure.Type: GrantFiled: May 27, 2022Date of Patent: April 30, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyunsub Rie, Eunseok Shin, Youngdon Choi, Changsoo Yoon, Hyunyoon Cho, Junghwan Choi
-
Patent number: 11914416Abstract: A transmitter circuit that receives parallel signals and outputs a serial signal in response to the parallel signals may include; a clock generator generating first clock signals having different respective phases, a multiplexer including selection circuits respectively configured to selectively provide at least two of the parallel signals to an output node in response to at least two of the first clock signals, and an output driver generating the serial signal by amplifying a signal at the output node.Type: GrantFiled: May 5, 2022Date of Patent: February 27, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Junyoung Park, Joohwan Kim, Jindo Byun, Eunseok Shin, Hyunyoon Cho, Youngdon Choi, Junghwan Choi
-
Publication number: 20240030089Abstract: A method of manufacturing a semiconductor package is provided and includes: forming a lower redistribution structure, the lower redistribution structure including lower redistribution patterns having lower connection pads; forming an upper redistribution structure on a boundary surface of the lower redistribution structure, the upper redistribution structure including upper redistribution patterns having upper connection pads electrically connected to the lower connection pads; forming openings exposing at least a portion of each of the lower connection pads; disposing an interposer substrate, including the lower redistribution structure and the upper redistribution structure, on a base substrate, the lower connection pads of the interposer substrate electrically connected to wiring patterns of the base substrate through lower connection bumps disposed on the openings; and disposing at least one of semiconductor chips, including connection pads, on the interposer substrate, the connection pads electrically coType: ApplicationFiled: September 27, 2023Publication date: January 25, 2024Applicant: Samsung Electronics Co., Ltd.Inventors: Eunseok Cho, Minjeong Gu, Joonsung Kim, Jaehoon Choi
-
Patent number: 11798862Abstract: A semiconductor package includes a base substrate including a wiring pattern, an interposer substrate including lower and upper redistribution patterns, a semiconductor structure, a heat dissipation structure, a plurality of external connection bumps disposed on a lower surface of the base substrate, a plurality of lower connection bumps disposed between the base substrate and the interposer substrate, and a plurality of upper connection bumps disposed between the interposer substrate and the semiconductor structure.Type: GrantFiled: June 22, 2021Date of Patent: October 24, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eunseok Cho, Minjeong Gu, Joonsung Kim, Jaehoon Choi
-
Publication number: 20220108935Abstract: A semiconductor package includes a base substrate including a wiring pattern, an interposer substrate including lower and upper redistribution patterns, a semiconductor structure, a heat dissipation structure, a plurality of external connection bumps disposed on a lower surface of the base substrate, a plurality of lower connection bumps disposed between the base substrate and the interposer substrate, and a plurality of upper connection bumps disposed between the interposer substrate and the semiconductor structure.Type: ApplicationFiled: June 22, 2021Publication date: April 7, 2022Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eunseok CHO, Minjeong GU, Joonsung KIM, Jaehoon CHOI
-
Patent number: 10658266Abstract: A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.Type: GrantFiled: April 24, 2017Date of Patent: May 19, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae Choon Kim, Jichul Kim, Jin-Kwon Bae, Eunseok Cho
-
Patent number: 10198049Abstract: A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.Type: GrantFiled: March 15, 2017Date of Patent: February 5, 2019Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Heungkyu Kwon, Jae Choon Kim, Eunseok Cho, Jichul Kim
-
Publication number: 20170229373Abstract: A method for managing a temperature of a device includes determining a temperature of a circuit or a package including the circuit, and selectively operating a thermoelectric semiconductor based on the determined temperature to adjust the temperature of the circuit or the package.Type: ApplicationFiled: April 24, 2017Publication date: August 10, 2017Inventors: JAE CHOON KIM, JICHUL KIM, Jin-Kwon BAE, EUNSEOK CHO
-
Publication number: 20170185119Abstract: A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.Type: ApplicationFiled: March 15, 2017Publication date: June 29, 2017Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Heungkyu KWON, Jae Choon KIM, Eunseok CHO, Jichul KIM
-
Patent number: 9671141Abstract: A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board.Type: GrantFiled: December 7, 2015Date of Patent: June 6, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae Choon Kim, Jichul Kim, Jin-Kwon Bae, Eunseok Cho
-
Patent number: 9606591Abstract: A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.Type: GrantFiled: September 14, 2012Date of Patent: March 28, 2017Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Heungkyu Kwon, Jae Choon Kim, Eunseok Cho, Jichul Kim
-
Publication number: 20160084542Abstract: A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board.Type: ApplicationFiled: December 7, 2015Publication date: March 24, 2016Inventors: JAE CHOON KIM, JICHUL KIM, Jin-Kwon BAE, EUNSEOK CHO
-
Patent number: 9252031Abstract: Provided is a semiconductor package including a lower package, an interposer on the lower package, and an upper package on the interposer. The lower package may include a lower package substrate, a lower semiconductor chip on the lower package substrate, and a lower heat-transfer layer on the lower semiconductor chip. The interposer may include an interposer substrate, first and second heat-transfer openings defined by recessed bottom and top surfaces, respectively, of the interposer substrate, an upper interposer heat-transfer pad disposed in the second heat-transfer opening, and an upper heat-transfer layer disposed on the upper interposer heat-transfer pad. The upper package may include an upper package substrate, an upper package heat-transfer pad, which may be disposed in a third heat-transfer opening defined by a recessed bottom surface of the upper package substrate, and an upper semiconductor chip disposed on the upper package substrate.Type: GrantFiled: September 23, 2014Date of Patent: February 2, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hohyeuk Im, Jongkook Kim, Gowoon Seong, SeokWon Lee, Byoungwook Jang, Eunseok Cho
-
Patent number: 9228763Abstract: Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.Type: GrantFiled: December 3, 2012Date of Patent: January 5, 2016Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae Choon Kim, Jichul Kim, Jin-Kwon Bae, Eunseok Cho
-
Patent number: 9030826Abstract: Chip-on-film packages are provided. A chip-on-film package includes a film substrate having a first surface and a second surface opposite to each other, a semiconductor chip on the first surface, and a thermal deformation member adjacent to the second surface. The thermal deformation member has a construction that causes its shape to transform according to a temperature. Related devices and device assembles are also provided.Type: GrantFiled: June 28, 2012Date of Patent: May 12, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Jichul Kim, Jae Choon Kim, Young-deuk Kim, Eunseok Cho
-
Publication number: 20150084170Abstract: Provided is a semiconductor package including a lower package, an interposer on the lower package, and an upper package on the interposer. The lower package may include a lower package substrate, a lower semiconductor chip on the lower package substrate, and a lower heat-transfer layer on the lower semiconductor chip. The interposer may include an interposer substrate, first and second heat-transfer openings defined by recessed bottom and top surfaces, respectively, of the interposer substrate, an upper interposer heat-transfer pad disposed in the second heat-transfer opening, and an upper heat-transfer layer disposed on the upper interposer heat-transfer pad. The upper package may include an upper package substrate, an upper package heat-transfer pad, which may be disposed in a third heat-transfer opening defined by a recessed bottom surface of the upper package substrate, and an upper semiconductor chip disposed on the upper package substrate.Type: ApplicationFiled: September 23, 2014Publication date: March 26, 2015Inventors: Hohyeuk IM, JONGKOOK KIM, Gowoon SEONG, SeokWon LEE, BYOUNGWOOK JANG, EUNSEOK CHO
-
Patent number: 8988645Abstract: A display device includes a panel including pixels defined by data lines and gate lines, a housing chassis covering a sidewall and an edge of the panel, a printed circuit board under the panel, the printed circuit board including circuit elements configured to generate at least one of a data signal, a gate signal, and a control signal, a chip on film connecting the printed circuit board to the panel, the chip on film between the housing chassis and the sidewall of the panel, a driver integrated circuit mounted on the chip on film and configured to respond to the control signal and drive at least one of the data signal and the gate signal applied to the data lines and the gate lines, and a connection unit attaching the chip on film to the housing chassis and dissipating heat generated by the driver integrated circuit to the housing chassis.Type: GrantFiled: August 28, 2012Date of Patent: March 24, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Jichul Kim, Young-Deuk Kim, Eunseok Cho, Mi-Na Choi
-
Patent number: 8988115Abstract: A method for controlling a temperature of an electronic device which includes a semiconductor chip is provided. The temperature control method includes measuring a temperature of a measurement point using the electronic device, comparing the temperature of the measurement point with a target temperature varying according to a period of time when the semiconductor chip operates using the electronic device, and decreasing a clock frequency of the semiconductor chip using the electronic device when the temperature of the measurement point is higher than the target temperature.Type: GrantFiled: March 14, 2013Date of Patent: March 24, 2015Assignee: Samsung Electronics Co., Ltd.Inventors: Jaechoon Kim, SangWook Ju, Eunseok Cho
-
Publication number: 20140327129Abstract: Provided is a package on package (PoP) device and a method of manufacturing the same. In the PoP device, a thermal interface material layer is interposed between a lower semiconductor chip and an upper package substrate, and a heat sink is disposed on an upper semiconductor package substrate. This maximizes heat release. Accordingly, an operation speed can be improved and malfunction limitation can be solved.Type: ApplicationFiled: March 27, 2014Publication date: November 6, 2014Inventors: Eunseok CHO, Heejung HWANG
-
Publication number: 20140184312Abstract: An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.Type: ApplicationFiled: March 4, 2014Publication date: July 3, 2014Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Jae Choon KIM, Eunseok CHO, Mi-Na CHOI, Kyoungsei CHOI, Heejung HWANG, Seran BAE