Abstract: A semiconductor memory device may include a substrate, a plurality of lower electrodes on the substrate, and a support structure. The plurality of lower electrodes may extend in a first direction perpendicular to a top surface of the substrate. The support structure may have a flat panel shape. The support structure may contact a side surface of the plurality of lower electrodes and may support the plurality of lower electrodes. The support structure may include a plurality of openings. The support structure may include a first part and a second part. The first part may include the plurality of openings repeated by a first pitch. The second part may include the plurality of openings repeated by a second pitch that is different from the first pitch.

Abstract: Methods of forming fine patterns for semiconductor devices are provided. A method may include sequentially forming a lower layer and a mask layer having first openings on a substrate, forming pillars to fill the first openings and protrude upward from a top surface of the mask layer, forming a block copolymer layer on the substrate with the pillars, performing a thermal treatment to the block copolymer layer to form a first block portion and second block portions, removing the second block portions to form guide openings exposing the mask layer, and etching the mask layer exposed by the guide openings to form second openings.

Abstract: Methods of forming fine patterns for semiconductor devices are provided. A method may include sequentially forming a lower layer and a mask layer having first openings on a substrate, forming pillars to fill the first openings and protrude upward from a top surface of the mask layer, forming a block copolymer layer on the substrate with the pillars, performing a thermal treatment to the block copolymer layer to form a first block portion and second block portions, removing the second block portions to form guide openings exposing the mask layer, and etching the mask layer exposed by the guide openings to form second openings.