Patents by Inventor Eunsook Barber

Eunsook Barber has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sintering pastes with high metal loading for semiconductor die attach applications
    Patent number: 10727193
    Abstract: A semiconductor die attach composition with greater than 60% metal volume after thermal reaction having: (a) 80-99 wt % of a mixture of metal particles comprising 30-70 wt % of a lead-free low melting point (LMP) particle composition comprising at least one LMP metal Y that melts below a temperature T1, and 25-70 wt % of a high melting point (HMP) particle composition comprising at least one metallic element M that is reactive with the at least one LMP metal Y at a process temperature T1, wherein the ratio of wt % of M to wt % of Y is at least 1.0; (b) 0-30 wt % of a metal powder additive A; and (c) a fluxing vehicle having a volatile portion, and not more than 50 wt % of a non-volatile portion.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: July 28, 2020
    Assignee: ORMET CIRCUITS, INC.
    Inventors: Catherine Shearer, Eunsook Barber, Michael Matthews
  • SINTERING PASTES WITH HIGH METAL LOADING FOR SEMICONDUCTOR DIE ATTACH APPLICATIONS
    Publication number: 20180358318
    Abstract: A semiconductor die attach composition with greater than 60% metal volume after thermal reaction having: (a) 80-99 wt % of a mixture of metal particles comprising 30-70 wt % of a lead-free low melting point (LMP) particle composition comprising at least one LMP metal Y that melts below a temperature T1, and 25-70 wt % of a high melting point (HMP) particle composition comprising at least one metallic element M that is reactive with the at least one LMP metal Y at a process temperature T1, wherein the ratio of wt % of M to wt % of Y is at least 1.0; (b) 0-30 wt % of a metal powder additive A; and (c) a fluxing vehicle having a volatile portion, and not more than 50 wt % of a non-volatile portion.
    Type: Application
    Filed: April 27, 2016
    Publication date: December 13, 2018
    Inventors: Catherine Shearer, Eunsook Barber, Michael Matthews
  • Semiconductor packaging containing sintering die-attach material
    Patent number: 9583453
    Abstract: Sintering die-attach materials provide a lead-free solution for semiconductor packages with superior electrical, thermal and mechanical performance to prior art alternatives. Wafer-applied sintering materials form a metallurgical bond to both semiconductor die and adherends as well as throughout the die-attach joint and do not remelt at the original process temperature. Application to either one or both sides of the wafer, as well as paste a film application are disclosed.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: February 28, 2017
    Assignee: Ormet Circuits, Inc.
    Inventors: Catherine Shearer, Michael C Matthews, Peter A Matturi, Eunsook Barber, Richard Weaver
  • SEMICONDUCTOR PACKAGING CONTAINING SINTERING DIE-ATTACH MATERIAL
    Publication number: 20140131898
    Abstract: Sintering die-attach materials provide a lead-free solution for semiconductor packages with superior electrical, thermal and mechanical performance to prior art alternatives. Wafer-applied sintering materials form a metallurgical bond to both semiconductor die and adherends as well as throughout the die-attach joint and do not remelt at the original process temperature. Application to either one or both sides of the wafer, as well as paste a film application are disclosed.
    Type: Application
    Filed: May 30, 2013
    Publication date: May 15, 2014
    Inventors: Catherine Shearer, Michael C Matthews, Peter A Matturi, Eunsook Barber, Rick Weaver