Patents by Inventor Eunsook Chae

Eunsook Chae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer coated with a filled, spin-coatable material
    Patent number: 8212369
    Abstract: This invention is a semiconductor wafer having an active side and a back side opposite the active side, which back side is coated with a filled, spin-coatable coating, wherein the coating comprises a resin and a spherical filler characterized by an average particle diameter of greater than 2 ?m and a single peak particle size distribution. In another embodiment the invention is a method for producing a spin-coatable, B-stageable coating with a thixotropic index of 1.2 or less. In a third embodiment the invention is a method for producing a coated semiconductor wafer.
    Type: Grant
    Filed: July 30, 2009
    Date of Patent: July 3, 2012
    Assignee: Henkel AG & Co. KGaA
    Inventor: Eunsook Chae
  • SEMICONDUCTOR WAFER COATED WITH A FILLED, SPIN-COATABLE MATERIAL
    Publication number: 20100193973
    Abstract: This invention is a semiconductor wafer having an active side and a back side opposite the active side, which back side is coated with a filled, spin-coatable coating, wherein the coating comprises a resin and a spherical filler characterized by an average particle diameter of greater than 2 ?m and a single peak particle size distribution. In another embodiment the invention is a method for producing a spin-coatable, B-stageable coating with a thixotropic index of 1.2 or less. In a third embodiment the invention is a method for producing a coated semiconductor wafer.
    Type: Application
    Filed: July 30, 2009
    Publication date: August 5, 2010
    Inventor: Eunsook Chae
  • Die attach adhesives with improved stress performance
    Publication number: 20060235137
    Abstract: Adhesive compositions containing a base compound or resin and an epoxy resin with vinyl functionality, without a curing agent for the epoxy resin, show enhanced stress performance. The compositions can be used in microelectronic applications.
    Type: Application
    Filed: April 18, 2005
    Publication date: October 19, 2006
    Inventor: Eunsook Chae