Patents by Inventor EUNTARK LEE

EUNTARK LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230288811
    Abstract: The inventive concept provides an apparatus and method for treating a substrate with a gas. The apparatus includes a chamber having a process space in which the substrate is treated, a substrate support unit that supports the substrate in the process space, a gas supply unit that supplies a hydrophobic gas onto the substrate supported on the substrate support unit, and a controller that controls the substrate support unit and the gas supply unit. The substrate support unit includes a support plate on which the substrate is placed and a pin assembly that raises the substrate off the support plate or lowers the substrate onto the support plate, and the controller controls a degree of hydrophobization of a surface of the substrate by adjusting the pin assembly.
    Type: Application
    Filed: May 2, 2023
    Publication date: September 14, 2023
    Applicant: SEMES CO, LTD.
    Inventors: Moon Hyung BAE, Hye Bin BAEK, Youngseo AN, Euntark LEE, Min Jung PARK, Seunghan LEE, Jung-Hyun LEE
  • Publication number: 20210132499
    Abstract: The inventive concept provides an apparatus and method for treating a substrate with a gas. The apparatus includes a chamber having a process space in which the substrate is treated, a substrate support unit that supports the substrate in the process space, a gas supply unit that supplies a hydrophobic gas onto the substrate supported on the substrate support unit, and a controller that controls the substrate support unit and the gas supply unit. The substrate support unit includes a support plate on which the substrate is placed and a pin assembly that raises the substrate off the support plate or lowers the substrate onto the support plate, and the controller controls a degree of hydrophobization of a surface of the substrate by adjusting the pin assembly.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 6, 2021
    Applicant: SEMES CO., LTD.
    Inventors: Moon Hyung BAE, Hye Bin BAEK, Youngseo AN, Euntark LEE, Min Jung PARK, Seunghan LEE, Jung-Hyun LEE
  • Publication number: 20210134620
    Abstract: Embodiments of the inventive concept provides an apparatus for treating a substrate. An embodiment of the inventive concept comprises a housing having a process space therein; and a supporting unit supporting a substrate in the process space, and the supporting unit comprises a supporting plate supporting the substrate; a heater member provide in the supporting plate and heating the substrate; and a cooling unit provided below the heater member and cooling the supporting plate, the cooling unit comprises a cooling plate spaced apart from the heater member; and a nozzle provided in the cooling plate, and supplying a cooling gas to a bottom surface of the heater member; and a driver moving the cooling plate between a standby position spaced a first distance apart from the heater member and a cooling position spaced a second distance apart from the heater member, the second distance is shorter than the first distance.
    Type: Application
    Filed: November 3, 2020
    Publication date: May 6, 2021
    Inventors: Seunghan LEE, Jong Seok SEO, Euntark LEE, Jaeoh BANG, Sukhwan CHI
  • Publication number: 20170114456
    Abstract: An apparatus and a method for treating a substrate are disclosed. The apparatus may include a process chamber including an upper chamber and a lower chamber that are coupled to each other to define a treatment space, a supporting unit provided within the treatment space to support a substrate, and an exhausting element configured to exhaust an air from the treatment space or a neighboring region of the treatment space. The exhausting element may include an outer exhausting line connected to an outer exhausting hole, and the outer exhausting hole may be formed in or through the upper or lower chamber and may be connected to a contact surface, at which the upper and lower chambers are in contact with each other.
    Type: Application
    Filed: October 18, 2016
    Publication date: April 27, 2017
    Applicant: SEMES CO., LTD.
    Inventors: EUNTARK LEE, Jong Seok SEO