Patents by Inventor Eun-yeong KIM
Eun-yeong KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250050783Abstract: An apparatus provides information on a distance to empty (DTE) of a vehicle and an information providing method is performed thereby. The apparatus includes a display device configured to display DTE information of a vehicle and a controller configured to control operation of the display device. The controller determines low fuel efficiency-related information and high fuel efficiency-related information based on a current vehicle driving condition. The controller determines a low DTE value and a high DTE value based on the low fuel efficiency-related information, the high fuel efficiency-related information, and a current available battery energy. The controller also determines a current DTE value indicating a real-time DTE and controls operation of the display device to display the low DTE value, the high DTE value, and the current DTE value.Type: ApplicationFiled: January 16, 2024Publication date: February 13, 2025Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Kyeong Soo Song, Jin Hyung Lee, Seung Jae Yoo, Hyun Jong Ha, Jae Yeong Jeong, Eun Bin Kim, Seon Min Kim, Jong Hoon Ahn
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Patent number: 12211261Abstract: An apparatus for text-to-image generation which is a self-supervised based on one-stage generative adversarial network and uses a discriminator network that extracts an image feature may comprise: a text encoder that extracts a sentence vector from input text; a discriminator that determines whether or not an image matches the text from the sentence vector and the image input from a generator; and a decoder that is connected to an encoder inside the discriminator, wherein the decoder and the encoder form an autoencoder structure inside the discriminator.Type: GrantFiled: May 10, 2022Date of Patent: January 28, 2025Assignee: POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATIONInventors: Dai Jin Kim, Eun Yeong Jeon
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Patent number: 12024654Abstract: The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.Type: GrantFiled: June 12, 2020Date of Patent: July 2, 2024Assignee: LG CHEM, LTD.Inventors: Eun Yeong Kim, You Jin Kyung, Kwang Joo Lee, Ji Ho Han, Bora Yeon, Mi Jang
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Patent number: 11932784Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.Type: GrantFiled: August 13, 2020Date of Patent: March 19, 2024Assignee: LG CHEM, LTD.Inventors: Da Ae Kim, Ji Ho Han, Kwang Joo Lee, Eun Yeong Kim, Mi Jang
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Patent number: 11466178Abstract: A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.Type: GrantFiled: March 7, 2019Date of Patent: October 11, 2022Assignee: LG CHEM, LTD.Inventors: Eun Yeong Kim, Sera Kim, Kwang Joo Lee, Sang Hwan Kim, Sung Chan Park, Mi Seon Yoon
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Patent number: 11424153Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of ?30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.Type: GrantFiled: June 4, 2019Date of Patent: August 23, 2022Assignee: LG CHEM, LTD.Inventors: Mi Seon Yoon, Sera Kim, Kwang Joo Lee, Bora Yeon, Sang Hwan Kim, Eun Yeong Kim
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Publication number: 20220186092Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.Type: ApplicationFiled: August 13, 2020Publication date: June 16, 2022Applicant: LG CHEM, LTD.Inventors: Da Ae KIM, Ji Ho HAN, Kwang Joo LEE, Eun Yeong KIM, Mi JANG
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Publication number: 20220154053Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a reducing agent, and a photoinitiator.Type: ApplicationFiled: August 14, 2020Publication date: May 19, 2022Applicant: LG CHEM, LTD.Inventors: Da Ae KIM, Ji Ho HAN, Kwang Joo LEE, Eun Yeong KIM, Mi JANG
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Publication number: 20210388244Abstract: The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.Type: ApplicationFiled: June 12, 2020Publication date: December 16, 2021Applicant: LG CHEM, LTD.Inventors: Eun Yeong KIM, You Jin KYUNG, Kwang Joo LEE, Ji Ho HAN, Bora YEON, Mi JANG
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Publication number: 20210035847Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of ?30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.Type: ApplicationFiled: June 4, 2019Publication date: February 4, 2021Applicant: LG CHEM, LTD.Inventors: Mi Seon YOON, Sera KIM, Kwang Joo LEE, Bora YEON, Sang Hwan KIM, Eun Yeong KIM
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Publication number: 20210002518Abstract: A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.Type: ApplicationFiled: March 7, 2019Publication date: January 7, 2021Applicant: LG CHEM, LTD.Inventors: Eun Yeong KIM, Sera KIM, Kwang Joo LEE, Sang Hwan KIM, Sung Chan PARK, Mi Seon YOON
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Publication number: 20200369925Abstract: The present invention relates to a back grinding tape including a polymer substrate and an adhesive layer, wherein the adhesive layer includes a (meth)acrylate resin containing 30 to 60% by weight of a repeating unit derived from a monomer or an oligomer having a glass transition temperature of 0° C. or higher, and wherein the adhesive layer has a glass transition temperature of ?20° C. to 10° C., and a method of grinding wafers using the back grinding tape.Type: ApplicationFiled: January 11, 2019Publication date: November 26, 2020Applicant: LG CHEM, LTD.Inventors: Mi Seon YOON, Se Ra KIM, Kwang Joo LEE, Bora YEON, Sung Chan PARK, Eun Yeong KIM
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Patent number: 10456114Abstract: Provided is a method of marking a diffusion boundary of medicine, the method performed by an ultrasound apparatus and including operations of obtaining first B mode image data and first Doppler data about a target object to which the medicine is injected; detecting a first area of the target object from which the first Doppler data is obtained; determining a first diffusion boundary of the medicine, based on the first area; and marking the first diffusion boundary of the medicine on a B mode image that is generated by using the first B mode image data.Type: GrantFiled: March 12, 2015Date of Patent: October 29, 2019Assignees: Samsung Medison Co., Ltd., Samsung Electronics Co., Ltd.Inventors: Eun-mi Cho, Jung-taek Oh, Eun-yeong Kim
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Publication number: 20150257741Abstract: Provided is a method of marking a diffusion boundary of medicine, the method performed by an ultrasound apparatus and including operations of obtaining first B mode image data and first Doppler data about a target object to which the medicine is injected; detecting a first area of the target object from which the first Doppler data is obtained; determining a first diffusion boundary of the medicine, based on the first area; and marking the first diffusion boundary of the medicine on a B mode image that is generated by using the first B mode image data.Type: ApplicationFiled: March 12, 2015Publication date: September 17, 2015Inventors: Eun-mi CHO, Jung-taek OH, Eun-yeong KIM