Patents by Inventor Eun-yeong KIM

Eun-yeong KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250050783
    Abstract: An apparatus provides information on a distance to empty (DTE) of a vehicle and an information providing method is performed thereby. The apparatus includes a display device configured to display DTE information of a vehicle and a controller configured to control operation of the display device. The controller determines low fuel efficiency-related information and high fuel efficiency-related information based on a current vehicle driving condition. The controller determines a low DTE value and a high DTE value based on the low fuel efficiency-related information, the high fuel efficiency-related information, and a current available battery energy. The controller also determines a current DTE value indicating a real-time DTE and controls operation of the display device to display the low DTE value, the high DTE value, and the current DTE value.
    Type: Application
    Filed: January 16, 2024
    Publication date: February 13, 2025
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Kyeong Soo Song, Jin Hyung Lee, Seung Jae Yoo, Hyun Jong Ha, Jae Yeong Jeong, Eun Bin Kim, Seon Min Kim, Jong Hoon Ahn
  • Patent number: 12211261
    Abstract: An apparatus for text-to-image generation which is a self-supervised based on one-stage generative adversarial network and uses a discriminator network that extracts an image feature may comprise: a text encoder that extracts a sentence vector from input text; a discriminator that determines whether or not an image matches the text from the sentence vector and the image input from a generator; and a decoder that is connected to an encoder inside the discriminator, wherein the decoder and the encoder form an autoencoder structure inside the discriminator.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: January 28, 2025
    Assignee: POSTECH RESEARCH AND BUSINESS DEVELOPMENT FOUNDATION
    Inventors: Dai Jin Kim, Eun Yeong Jeon
  • Patent number: 12024654
    Abstract: The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: July 2, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Eun Yeong Kim, You Jin Kyung, Kwang Joo Lee, Ji Ho Han, Bora Yeon, Mi Jang
  • Patent number: 11932784
    Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: March 19, 2024
    Assignee: LG CHEM, LTD.
    Inventors: Da Ae Kim, Ji Ho Han, Kwang Joo Lee, Eun Yeong Kim, Mi Jang
  • Patent number: 11466178
    Abstract: A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: October 11, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Eun Yeong Kim, Sera Kim, Kwang Joo Lee, Sang Hwan Kim, Sung Chan Park, Mi Seon Yoon
  • Patent number: 11424153
    Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of ?30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: August 23, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Mi Seon Yoon, Sera Kim, Kwang Joo Lee, Bora Yeon, Sang Hwan Kim, Eun Yeong Kim
  • Publication number: 20220186092
    Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a singlet oxygen scavenger, a photosensitizer, and a photoinitiator.
    Type: Application
    Filed: August 13, 2020
    Publication date: June 16, 2022
    Applicant: LG CHEM, LTD.
    Inventors: Da Ae KIM, Ji Ho HAN, Kwang Joo LEE, Eun Yeong KIM, Mi JANG
  • Publication number: 20220154053
    Abstract: The present invention provides an adhesive composition for a dicing tape, which may prevent the success rate of chip pick-up from decreasing due to an oxygen inhibition phenomenon occurring in a dicing process, and a dicing tape including the same. The adhesive composition for a dicing tape includes an adhesive binder, a reducing agent, and a photoinitiator.
    Type: Application
    Filed: August 14, 2020
    Publication date: May 19, 2022
    Applicant: LG CHEM, LTD.
    Inventors: Da Ae KIM, Ji Ho HAN, Kwang Joo LEE, Eun Yeong KIM, Mi JANG
  • Publication number: 20210388244
    Abstract: The present disclosure relates to a non-conductive film comprising an adhesive layer containing a low molecular weight epoxy resin; and a tacky layer containing a predetermined composition, and a method for manufacturing a semiconductor laminate using the non-conductive film.
    Type: Application
    Filed: June 12, 2020
    Publication date: December 16, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Eun Yeong KIM, You Jin KYUNG, Kwang Joo LEE, Ji Ho HAN, Bora YEON, Mi JANG
  • Publication number: 20210035847
    Abstract: The present disclosure relates to a back grinding tape including a polymer resin layer including a urethane (meth)acrylate resin containing 10 to 40 wt % of a repeating unit derived from a (meth)acrylate monomer or oligomer having a glass transition temperature of 0° C. or higher, wherein the polymer resin layer has a glass transition temperature of ?30° C. to 0° C. The present disclosure also relates to a method of grinding a wafer using the back grinding tape.
    Type: Application
    Filed: June 4, 2019
    Publication date: February 4, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Mi Seon YOON, Sera KIM, Kwang Joo LEE, Bora YEON, Sang Hwan KIM, Eun Yeong KIM
  • Publication number: 20210002518
    Abstract: A back grinding tape including a hard coating layer, an intermediate layer including a polyurethane-based resin, and an adhesive layer provided has an excellent water resistance, thus easily protecting patterns, and has an excellent adhesion between each layer, and thus each layer is not separated in the process of removing the tape, such that the back grinding tape is suitable for a back grinding process.
    Type: Application
    Filed: March 7, 2019
    Publication date: January 7, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Eun Yeong KIM, Sera KIM, Kwang Joo LEE, Sang Hwan KIM, Sung Chan PARK, Mi Seon YOON
  • Publication number: 20200369925
    Abstract: The present invention relates to a back grinding tape including a polymer substrate and an adhesive layer, wherein the adhesive layer includes a (meth)acrylate resin containing 30 to 60% by weight of a repeating unit derived from a monomer or an oligomer having a glass transition temperature of 0° C. or higher, and wherein the adhesive layer has a glass transition temperature of ?20° C. to 10° C., and a method of grinding wafers using the back grinding tape.
    Type: Application
    Filed: January 11, 2019
    Publication date: November 26, 2020
    Applicant: LG CHEM, LTD.
    Inventors: Mi Seon YOON, Se Ra KIM, Kwang Joo LEE, Bora YEON, Sung Chan PARK, Eun Yeong KIM
  • Patent number: 10456114
    Abstract: Provided is a method of marking a diffusion boundary of medicine, the method performed by an ultrasound apparatus and including operations of obtaining first B mode image data and first Doppler data about a target object to which the medicine is injected; detecting a first area of the target object from which the first Doppler data is obtained; determining a first diffusion boundary of the medicine, based on the first area; and marking the first diffusion boundary of the medicine on a B mode image that is generated by using the first B mode image data.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: October 29, 2019
    Assignees: Samsung Medison Co., Ltd., Samsung Electronics Co., Ltd.
    Inventors: Eun-mi Cho, Jung-taek Oh, Eun-yeong Kim
  • Publication number: 20150257741
    Abstract: Provided is a method of marking a diffusion boundary of medicine, the method performed by an ultrasound apparatus and including operations of obtaining first B mode image data and first Doppler data about a target object to which the medicine is injected; detecting a first area of the target object from which the first Doppler data is obtained; determining a first diffusion boundary of the medicine, based on the first area; and marking the first diffusion boundary of the medicine on a B mode image that is generated by using the first B mode image data.
    Type: Application
    Filed: March 12, 2015
    Publication date: September 17, 2015
    Inventors: Eun-mi CHO, Jung-taek OH, Eun-yeong KIM