Patents by Inventor Eun-Yong JEON

Eun-Yong JEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11143534
    Abstract: According to an exemplary embodiment, a microneedle probe device for measuring a sap flow rate of a plant includes: a substrate, of which at least a part is inserted into a plant, and a thickness and a width are microscales; a single metal wire provided on the substrate; a power source, which applies a current to the metal wire for a predetermined time and heats the metal wire; and a processor, which calculates a flow rate of sap through a movement of heat generated in the metal wire according to a flow of the sap within the plant.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: October 12, 2021
    Assignees: Seoul National University R&DB Foundation, Republic Of Korea Rural Development Administration
    Inventors: Jung Hoon Lee, Sang Woong Baek, Eun Yong Jeon, Seung Yul Choi, Kyoung Sub Park, Joon Kook Kwon, Kyung Hwan Yeo, In Ho Yu, Jae Han Lee
  • Publication number: 20190257681
    Abstract: According to an exemplary embodiment, a microneedle probe device for measuring a sap flow rate of a plant includes: a substrate, of which at least a part is inserted into a plant, and a thickness and a width are microscales; a single metal wire provided on the substrate; a power source, which applies a current to the metal wire for a predetermined time and heats the metal wire; and a processor, which calculates a flow rate of sap through a movement of heat generated in the metal wire according to a flow of the sap within the plant.
    Type: Application
    Filed: June 14, 2017
    Publication date: August 22, 2019
    Inventors: Jung Hoon Lee, Sang Woong Baek, Eun Yong Jeon, Seung Yul Choi, Kyoung Sub Park, Joon Kook Kwon, Kyung Hwan Yeo, In Ho Yu, Jae Han Lee
  • Patent number: 10285278
    Abstract: A display apparatus may include a substrate, a pad unit on the substrate, a display panel on the substrate, an encapsulation layer covering the display panel, and a protective layer on the pad unit. The protective layer may have an elastic coefficient ranging from about 10 MPa to about 200 GPa.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: May 7, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jun Namkung, Soon-Ryong Park, Ju-Yeop Seong, Jung-Ho So, Eun-Yong Jeon, Seok-Gi Baek, Kwang-Hyeok Kim, Chul-Woo Jeong
  • Publication number: 20150077953
    Abstract: A display apparatus may include a substrate, a pad unit on the substrate, a display panel on the substrate, an encapsulation layer covering the display panel, and a protective layer on the pad unit. The protective layer may have an elastic coefficient ranging from about 10 MPa to about 200 GPa.
    Type: Application
    Filed: July 1, 2014
    Publication date: March 19, 2015
    Inventors: Jun NAMKUNG, Soon-Ryong PARK, Ju-Yeop SEONG, Jung-Ho SO, Eun-Yong JEON, Seok-Gi BAEK, Kwang-Hyeok KIM, Chul-Woo JEONG