Patents by Inventor Eva Murphy

Eva Murphy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked MEMS device
    Patent number: 7928584
    Abstract: A MEMS apparatus has a MEMS device sandwiched between a base and a circuit chip. The movable member of the MEMS device is attached at the side up against the circuit chip. The movable member may be mounted on a substrate of the MEMS device or formed directly on a passivation layer on the circuit chip. The circuit chip provides control signals to the MEMS device through wire bonds, vias through the MEMS device or a conductive path such as solder balls external to the MEMS device.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: April 19, 2011
    Assignee: Analog Devices, Inc.
    Inventors: Liam O Suilleabhain, Raymond Goggin, Eva Murphy, Kieran P. Harney
  • Stacked MEMS Device
    Publication number: 20100032268
    Abstract: A MEMS apparatus has a MEMS device sandwiched between a base and a circuit chip. The movable member of the MEMS device is attached at the side up against the circuit chip. The movable member may be mounted on a substrate of the MEMS device or formed directly on a passivation layer on the circuit chip. The circuit chip provides control signals to the MEMS device through wire bonds, vias through the MEMS device or a conductive path such as solder balls external to the MEMS device.
    Type: Application
    Filed: October 20, 2009
    Publication date: February 11, 2010
    Applicant: Analog Devices, Inc.
    Inventors: Liam O. Suilleabhain, Raymond Goggin, Eva Murphy, Kieran P. Harney
  • Stacked MEMS device
    Patent number: 7642657
    Abstract: A MEMS apparatus has a MEMS device sandwiched between a base and a circuit chip. The movable member of the MEMS device is attached at the side up against the circuit chip. The movable member may be mounted on a substrate of the MEMS device or formed directly on a passivation layer on the circuit chip. The circuit chip provides control signals to the MEMS device through wire bonds, vias through the MEMS device or a conductive path such as solder balls external to the MEMS device.
    Type: Grant
    Filed: December 19, 2007
    Date of Patent: January 5, 2010
    Assignee: Analog Devices, Inc.
    Inventors: Liam O Suilleabhain, Raymond Goggin, Eva Murphy, Kieran P. Harney
  • Stacked MEMS Device
    Publication number: 20080157339
    Abstract: A MEMS apparatus has a MEMS device sandwiched between a base and a circuit chip. The movable member of the MEMS device is attached at the side up against the circuit chip. The movable member may be mounted on a substrate of the MEMS device or formed directly on a passivation layer on the circuit chip. The circuit chip provides control signals to the MEMS device through wire bonds, vias through the MEMS device or a conductive path such as solder balls external to the MEMS device.
    Type: Application
    Filed: December 19, 2007
    Publication date: July 3, 2008
    Applicant: ANALOG DEVICES, INC.
    Inventors: Liam O Suilleabhain, Raymond Goggin, Eva Murphy, Kieran Harney