Patents by Inventor Eva RIEGLER

Eva RIEGLER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component Carrier Interconnection and Manufacturing Method
    Publication number: 20220386464
    Abstract: A component carrier assembly includes a first component carrier having a first electrically insulating layer structure and a via in the first electrically insulating layer structure, where the via is at least partially filled with electrically conductive material and where an upper part of the via extends beyond an outer main surface of the first component carrier; and a second component carrier having a second electrically insulating layer structure, and an electrically conductive adhesive material that is at least partially embedded in the second electrically insulating layer structure. The first component carrier and the second component carrier are interconnected and the upper part of the via at least partially penetrates into the electrically conductive adhesive material.
    Type: Application
    Filed: May 25, 2022
    Publication date: December 1, 2022
    Inventors: Abderrazzaq IFIS, Jens RIEDLER, Eva RIEGLER