Patents by Inventor Eva Yim

Eva Yim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shallow trench avoidance in integrated circuits
    Patent number: 7475381
    Abstract: Diffusion regions in a standard cell design are bridged across cell boundaries. Shallow trench isolation is reduced and nitride passivation thickness variation is reduced.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: January 6, 2009
    Assignee: Intel Corporation
    Inventors: Jeffrey B. Davis, Rajashri Doddamani, Byungha Joo, Duc G. Nguyen, Darshana Surti, Eva Yim
  • Shallow trench avoidance in integrated circuits
    Publication number: 20070240082
    Abstract: Diffusion regions in a standard cell design are bridged across cell boundaries. Shallow trench isolation is reduced and nitride passivation thickness variation is reduced.
    Type: Application
    Filed: March 30, 2006
    Publication date: October 11, 2007
    Inventors: Jeffrey Davis, Rajashri Doddamani, Byungha Joo, Duc Nguyen, Darshana Surti, Eva Yim