Patents by Inventor Evan A. Aanerud

Evan A. Aanerud has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wire bonding technique for integrated circuit board connections
    Patent number: 10600756
    Abstract: A method is provided for connecting a chip die to a circuit board with a capillary dispenser to deposit gold. The method includes forming a first bond by depositing gold from the dispenser to a board pad on the circuit board; forming a second bond by depositing the gold from the dispenser to a die pad on the chip die; extruding a filament of the gold by the dispenser in a normal direction from the second bond; rotating the filament laterally away from the first bond along a first radius; extruding the filament while rotating the filament towards the first bond along a second radius larger than the first radius; and forming a third bond by depositing the gold on the first bond to form a third bond.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: March 24, 2020
    Assignee: United States of America, as represented by the Secretary of the Navy
    Inventors: Evan A. Aanerud, Kahle B. Sullivan, James J. Malove, Justin M. Dougherty