Patents by Inventor Evan A. Binkerd

Evan A. Binkerd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked modular architecture high-resolution thermal chip camera
    Patent number: 9787914
    Abstract: An uncooled high-resolution 12 micron pixel pitch 3D-stacked component thermal camera including an electronics board, a camera circuit card assembly (CCA) with an application-specific integrated circuit (ASIC), a synchronous dynamic random access memory (SDRAM), flash memory, a spacer, a wafer level packaged Focal Plane Array (FPA) wafer with a lens housing attach ring on the FPA, and a window.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: October 10, 2017
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Louise C Sengupta, Pierre-Alain S Auroux, Evan A Binkerd, Richard J Blackwell, Jr., Mihir D Boal, Jeffrey F Bryant, Don A Harris, Donald D McManus
  • STACKED MODULAR ARCHITECTURE HIGH-RESOLUTION THERMAL CHIP CAMERA
    Publication number: 20170070685
    Abstract: An uncooled high-resolution 12 micron pixel pitch 3D-stacked component thermal camera including an electronics board, a camera circuit card assembly (CCA) with an application-specific integrated circuit (ASIC), a synchronous dynamic random access memory (SDRAM), flash memory, a spacer, a wafer level packaged Focal Plane Array (FPA) wafer with a lens housing attach ring on the FPA, and a window.
    Type: Application
    Filed: September 4, 2015
    Publication date: March 9, 2017
    Inventors: Louise C. Sengupta, Pierre-Alain S. Auroux, Evan A. Binkerd, Richard J. Blackwell, JR., Mihir D. Boal, Jeffrey F. Bryant, Don A. Harris, Donald D. McManus