Patents by Inventor Evan A. Chenelly
Evan A. Chenelly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11855353Abstract: The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.Type: GrantFiled: July 20, 2020Date of Patent: December 26, 2023Assignee: Intel CorporationInventors: Trang Thuy Thai, Sidharth Dalmia, Jonathan C. Jensen, Josef Hagn, Baljit Singh, Bhagyashree S. Ganore, Daniel Roberts Cox, Evan A. Chenelly
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Patent number: 11557529Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.Type: GrantFiled: March 30, 2018Date of Patent: January 17, 2023Assignee: Intel CorporationInventors: Thomas Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig J. Jahne, Andrew Larson, Eric W. Buddrius, Eric D. McAfee, Mustafa Haswarey, Ralph V. Miele, Rolf Laido
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Publication number: 20210321543Abstract: An apparatus is described. The apparatus includes a module to be inserted into an electronic system. The module includes a first heat exchanger at one end of the module and second heat exchanger at another end of the module. The module also includes a first vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a first side of the module and a second vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a second side of the module. The first heat exchanger is in thermal contact with at least one of the first and second vapor chambers, and, the second heat exchanger is in thermal contact with at least one of the first and second vapor chambers.Type: ApplicationFiled: June 24, 2021Publication date: October 14, 2021Inventors: Guixiang TAN, Xiang LI, Jimmy CHUANG, Devdatta P. KULKARNI, Casey WINKEL, Evan A. CHENELLY
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Publication number: 20210320048Abstract: A cold plate with an integrated vapor chamber allows for improved temperature equalization across integrated circuit dies in an integrated circuit component. The cold plate comprises a first chamber and a vapor chamber that share a common inner wall. The cold plate is attached to an integrated circuit component positioned adjacent to the vapor chamber. Heat generated by integrated circuit dies is transferred to the vapor chamber where it is absorbed by a two-phase working fluid as latent heat. Heat is removed from the vapor chamber by a cooling liquid flowing through the cold plate absorbing heat ejected from the working fluid as it condenses. The heated cooling liquid exits the cold plate at a fluid outlet. Cold plates with integrated vapor chambers can be used to equalize temperatures across multiple integrated circuit components in a similar fashion.Type: ApplicationFiled: June 24, 2021Publication date: October 14, 2021Applicant: Intel CorporationInventors: Ameya Limaye, Evan A. Chenelly
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Patent number: 11032941Abstract: Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.Type: GrantFiled: March 28, 2019Date of Patent: June 8, 2021Assignee: Intel CorporationInventors: Minh Le, Thomas Boyd, Bijoyraj Sahu, Evan Chenelly, Christopher Wade Ackerman, Carlos Alvizo Flores, Craig Jahne
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Publication number: 20210075122Abstract: The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.Type: ApplicationFiled: July 20, 2020Publication date: March 11, 2021Applicant: Intel IP CorporationInventors: Trang Thuy Thai, Sidharth Dalmia, Jonathan C. Jensen, Josef Hagn, Baljit Singh, Bhagyashree S. Ganore, Daniel Roberts Cox, Evan A. Chenelly
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Patent number: 10741932Abstract: The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.Type: GrantFiled: September 28, 2018Date of Patent: August 11, 2020Assignee: Intel IP CorporationInventors: Trang Thuy Thai, Sidharth Dalmia, Jonathan C. Jensen, Josef Hagn, Baljit Singh, Bhagyashree S. Ganore, Daniel Roberts Cox, Evan A. Chenelly
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Patent number: 10595439Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a cooling apparatus that includes a first heatsink, a second movable heatsink and a flexible thermal conductor physically and thermally coupled with the first and second heatsinks, where the flexible thermal conductor is to flex and remain thermally coupled with the first heatsink and the second heatsink, when the second heatsink is moved relative to the first heatsink. The first heatsink may be coupled to a heat source such as a processor that may be coupled with a PCB. Also, the movable heatsink may allow access to components, such as dual in-line memory modules (DIMMs) that are next to the first heatsink and under the movable second heatsink. Other embodiments may be described and/or claimed.Type: GrantFiled: June 25, 2018Date of Patent: March 17, 2020Assignee: Intel CorporationInventors: David Shia, Evan Chenelly, Mohanraj Prabhugoud
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Publication number: 20190304870Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.Type: ApplicationFiled: March 30, 2018Publication date: October 3, 2019Applicant: Intel CorporationInventors: Thomas Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig J. Jahne, Andrew Larson, Eric W. Buddrius, Eric D. McAfee, Mustafa Haswarey, Ralph V. Miele, Rolf Laido
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Publication number: 20190223324Abstract: Systems, apparatuses, methods, and computer-readable media are presented for managing an apparatus for thermal energy management including a first container. The first container includes a first cavity, and is configured to hold a first liquid coolant within the first cavity to at least partially surround a second container. The second container includes a second cavity configured to hold one or more heat sources, and a second liquid coolant to at least partially surround the one or more heat sources. The second container is sealed to separate the first liquid coolant from the second liquid coolant. Other embodiments may be described and/or claimed.Type: ApplicationFiled: March 28, 2019Publication date: July 18, 2019Inventors: Minh Le, Thomas Boyd, Bijoyraj Sahu, Evan Chenelly, Christopher Wade Ackerman, Carlos Alvizo Flores, Craig Jahne
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Publication number: 20190103682Abstract: The techniques described herein relate to a Radio Frequency (RF) communication module for a hand-held mobile electronic device. The Radio Frequency (RF) communication module includes a circuit board and a plurality of antennas disposed on a top side and bottom side of the circuit board. The plurality of antennas comprise a first subset of antennas comprising end-fire antennas and a second subset of antennas comprising broadside antennas. The first subset of antennas and the second subset of antennas also have a bandwidth of approximately 40 percent. The Radio Frequency (RF) communication module also includes a shielded area comprising circuitry coupled to the circuit board for controlling the antennas.Type: ApplicationFiled: September 28, 2018Publication date: April 4, 2019Applicant: INTEL IP CORPORATIONInventors: Trang Thuy Thai, Sidharth Dalmia, Jonathan C. Jensen, Josef Hagn, Baljit Singh, Bhagyashree S. Ganore, Daniel Roberts Cox, Evan A. Chenelly
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Publication number: 20190045663Abstract: Embodiments described herein may include apparatuses, systems and/or processes to provide a cooling apparatus that includes a first heatsink, a second movable heatsink and a flexible thermal conductor physically and thermally coupled with the first and second heatsinks, where the flexible thermal conductor is to flex and remain thermally coupled with the first heatsink and the second heatsink, when the second heatsink is moved relative to the first heatsink. The first heatsink may be coupled to a heat source such as a processor that may be coupled with a PCB. Also, the movable heatsink may allow access to components, such as dual in-line memory modules (DIMMs) that are next to the first heatsink and under the movable second heatsink. Other embodiments may be described and/or claimed.Type: ApplicationFiled: June 25, 2018Publication date: February 7, 2019Inventors: David Shia, Evan Chenelly, Mohanraj Prabhugoud