Patents by Inventor Evan Angelico

Evan Angelico has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • POSITRON EMISSION TOMOGRAPHY SYSTEMS BASED ON IONIZATION-ACTIVATED ORGANIC FLUOR MOLECULES, PLANAR PIXELATED PHOTODETECTORS, OR BOTH
    Publication number: 20230400595
    Abstract: Gamma-ray detectors for the detection of one or more gamma-rays are provided. Also provided are methods of using the detectors for the detection of one or more gamma-rays. The detectors can be used in high-spatial resolution PET systems, including time-of-flight (TOF)-PET systems. Some of the gamma-ray detectors utilize fluors and an optical imaging system to determine the time and location of a first scattering event of a gamma-ray in a low atomic number scintillating medium. Some of the gamma-ray detectors determine the time and location of a first scattering event of a gamma-ray in a low-density scintillating medium by imaging scintillation photons from the scattering event as a time-series of photon “rings” using a planar pixilated photodetector as a scintillation photon counter.
    Type: Application
    Filed: October 26, 2021
    Publication date: December 14, 2023
    Inventors: Henry J. Frisch, Evan Angelico, Patrick J. La Riviere, Bernhard W. Adams, Eric Spieglan, Joao F. Shida, Andrey Elagin, Kepler Domurat-Sousa, Allison H. Squires
  • Dual low vacuum-ultrahigh vacuum system for large-scale production of micro-channel plate photomultipliers
    Patent number: 11715616
    Abstract: Systems and methods for the batch production of large numbers of highly uniform multichannel-plate photomultiplier tubes (MCP-PMTs) for large-scale applications are provided. The systems and methods employ dual, nested low-vacuum (LV) and UHV processing in a rapid-cycling, small-footprint, scalable, batch-production facility that is capable of fabricating many MCP-PMTs simultaneously.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: August 1, 2023
    Assignee: THE UNIVERSITY OF CHICAGO
    Inventors: Henry J. Frisch, Evan Angelico, Andrey Elagin, Eric Spieglan, Bernhard W. Adams
  • Methods of fabricating vacuum housings with hermetic solder seals using capillary solder wicks
    Patent number: 11194059
    Abstract: Hermetically sealed electronic devices and methods for fabricating the hermetically sealed electronic devices are provided. The devices include a solder sealed vacuum housing. The solder seal is formed using a solder wick having an external solder reservoir. When the reservoir is filled with molten solder, the solder is drawn via capillary action into a precisely defined narrow gap between two components of the housing where it forms an airtight and vacuum-tight seal.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: December 7, 2021
    Assignee: The University of Chicago
    Inventors: Henry J. Frisch, Evan Angelico, Andrey Elagin, Eric Spieglan
  • DUAL LOW VACUUM-ULTRAHIGH VACUUM SYSTEM FOR LARGE-SCALE PRODUCTION OF MICRO-CHANNEL PLATE PHOTOMULTIPLIERS
    Publication number: 20210134552
    Abstract: Systems and methods for the batch production of large numbers of highly uniform multichannel-plate photomultiplier tubes (MCP-PMTs) for large-scale applications are provided. The systems and methods employ dual, nested low-vacuum (LV) and UHV processing in a rapid-cycling, small-footprint, scalable, batch-production facility that is capable of fabricating many MCP-PMTs simultaneously.
    Type: Application
    Filed: October 28, 2020
    Publication date: May 6, 2021
    Inventors: Henry J. Frisch, Evan Angelico, Andrey Elagin, Eric Spieglan, Bernhard W. Adams
  • METHODS OF FABRICATING VACUUM HOUSINGS WITH HERMETIC SOLDER SEALS USING CAPILLARY SOLDER WICKS
    Publication number: 20200326433
    Abstract: Hermetically sealed electronic devices and methods for fabricating the hermetically sealed electronic devices are provided. The devices include a solder sealed vacuum housing. The solder seal is formed using a solder wick having an external solder reservoir. When the reservoir is filled with molten solder, the solder is drawn via capillary action into a precisely defined narrow gap between two components of the housing where it forms an airtight and vacuum-tight seal.
    Type: Application
    Filed: April 7, 2020
    Publication date: October 15, 2020
    Inventors: Henry J. Frisch, Evan Angelico, Andrey Elagin, Eric Spieglan