Patents by Inventor Evan B. Fleming

Evan B. Fleming has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11877423
    Abstract: A thermal management system to cool one or more battery packs of a battery system may include a heat pipe arrangement that includes a plurality of heat pipes, having a planar configuration, in thermal contact with the one or more battery packs to draw heat therefrom, and a heat sink arrangement that includes a plurality of heat sinks, in thermal contact with two or more edges of the heat pipe arrangement, to dissipate heat away from the heat pipe arrangement.
    Type: Grant
    Filed: October 8, 2020
    Date of Patent: January 16, 2024
    Assignees: Toyota Motor Engineering and Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
    Inventors: Gaohua Zhu, Tenghua Tom Shieh, Evan B. Fleming, Swetha Minupuri, Debasish Banerjee, Ryuta Sugiura, Yusuke Suzuki, Takayoshi Tanaka, Satoko Tofukuji
  • Publication number: 20220117116
    Abstract: A thermal management system to cool one or more battery packs of a battery system may include a heat pipe arrangement that includes a plurality of heat pipes, having a planar configuration, in thermal contact with the one or more battery packs to draw heat therefrom, and a heat sink arrangement that includes a plurality of heat sinks, in thermal contact with two or more edges of the heat pipe arrangement, to dissipate heat away from the heat pipe arrangement.
    Type: Application
    Filed: October 8, 2020
    Publication date: April 14, 2022
    Applicant: Toyota Motor Engineering and Manufacturing North America, Inc.
    Inventors: Gaohua Zhu, Tenghua Tom Shieh, Evan B. Fleming, Swetha Minupuri, Debasish Banerjee, Ryuta Sugiura, Yusuke Suzuki, Takayoshi Tanaka, Satoko Tofukuji
  • Patent number: 10975488
    Abstract: A method of manufacturing a heat transfer device includes manipulating the microstructure of a metal alloy to thereby remove one or more chemical components of the alloy to form resultant heat pipe structure having an envelope composed of the precursor metal alloy and a porous wick structure composed of the dealloyed metal. Manipulation of the microstructure may be conducted by selective etching of a substrate composed of a metal or metal alloy using a dealloying process.
    Type: Grant
    Filed: August 14, 2019
    Date of Patent: April 13, 2021
    Assignee: Toyota Motor Engineering and Manufacturing North America, Inc.
    Inventors: Evan B. Fleming, Gaohua Zhu
  • Publication number: 20210047747
    Abstract: A method of manufacturing a heat transfer device includes manipulating the microstructure of a metal alloy to thereby remove one or more chemical components of the alloy to form resultant heat pipe structure having an envelope composed of the precursor metal alloy and a porous wick structure composed of the dealloyed metal. Manipulation of the microstructure may be conducted by selective etching of a substrate composed of a metal or metal alloy using a dealloying process.
    Type: Application
    Filed: August 14, 2019
    Publication date: February 18, 2021
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Evan B. Fleming, Gaohua Zhu