Abstract: Curable resin compositions having extended open times at ambient temperatures and short cure times at elevated temperatures are prepared using a curable resin, a combination of room-temperature-stable liquid peroxides (including at least one perketal), a promoter salt, a thiol-functionalized organicd accelerator and a free radical trap. The curable resin compositions are useful in pultrusion, cure-in-place pipe and resin transfer molding applications, among others.

Abstract: Curable resin compositions having extended open times at ambient temperatures and short cure times at elevated temperatures are prepared using a curable resin, a combination of room-temperature-stable liquid peroxides (including at least one perketal), a promoter salt, a thiol-functionalized organic accelerator and a free radical trap. The curable resin compositions are useful in pultrusion, cure-in-place pipe and resin transfer molding applications, among others.

Abstract: The invention relates to the use of low levels of glycols and short chain diols to control air void formation in any polymerization reaction having carbonyl-containing monomers, and preferably carboxylic acid ester monomers, at a level of at least 10% of total monomer, where the monomer has a peak polymerization exotherm temperature of greater than the boiling point of the monomer. The glycols and short chain diols are used in the polymization mixture at levels of 0.5 to 10 weight percent, based on the carboxylic acid ester-containing monomer. It is believed the glycols and short chain diols hydrogen bond with the —(C?O)O— containing monomer to increase the monomer boiling point, and decrease or even eliminate the formation of air voids due to monomer boiling. The invention is especially useful in polymerization of methyl methacrylate polymers and copolymers, either neat, or as a polymer composite system.

Abstract: The invention relates to the use of low levels of aliphatic primary and secondary amines to control air void formation in any polymerization reaction having carbonyl groups, and especially carboxylic acid ester group-containing monomers at a level of at least 10% of total monomer, where the monomer has a peak polymerization exotherm temperature of greater than the boiling point of the monomer. The primary or secondary amines are used in the polymerization mixture at levels of 100 to 5000 ppm, based on the carboxylic acid ester group-containing monomer. It is believed the primary and secondary amines hydrogen bond with the —C?O)O— containing monomer to increase the monomer boiling point, and decrease or even eliminate the formation of air voids due to monomer boiling. The invention is especially useful in polymerization of methymethacrylate polymers and copolymers, either neat, or as a polymer composite system.

Abstract: Accelerator solutions containing transition metal complexes based on organic ligands having one or more S—C—N, S—C—C—N, or S—C(?S)—S moieties are useful for accelerating the peroxide cure of resins such as unsaturated polyester resins.

Abstract: Curable resin compositions having extended open times at ambient temperatures and short cure times at elevated temperatures are prepared using a curable resin, a combination of room-temperature-stable liquid peroxides (including at least one perketal), a promoter salt, a thiol-functionalized organic accelerator and a free radical trap. The curable resin compositions are useful in pultrusion, cure-in-place pipe and resin transfer molding applications, among others.

Abstract: The invention relates to the use of low levels of aliphatic short-chain saturated esters to control air void formation in any exothermic polymerization reaction in which the exotherm exceeds the boiling point of the monomer. One such polymerization is the bulk polymerization of one or more monomers having carboxylic acid ester monomers, at a level of at least 10% of total monomer. The aliphatic short-chain saturated esters are used in the polymerization mixture at levels of 0.5 to 10 weight percent, based on the carboxyl-containing monomer. The invention is especially useful in polymerization of methylmethacrylate polymers and copolymers, either neat, or as a polymer composite system.

Abstract: The invention relates to the use of low levels of aliphatic primary and secondary amines to control air void formation in any polymerization reaction having carbonyl groups, and especially carboxylic acid ester group-containing monomers at a level of at least 10% of total monomer, where the monomer has a peak polymerization exotherm temperature of greater than the boiling point of the monomer. The primary or secondary amines are used in the polymerization mixture at levels of 100 to 5000 ppm, based on the carboxylic acid ester group-containing monomer. It is believed the primary and secondary amines hydrogen bond with the —C?O)O— containing monomer to increase the monomer boiling point, and decrease or even eliminate the formation of air voids due to monomer boiling. The invention is especially useful in polymerization of methymethacrylate polymers and copolymers, either neat, or as a polymer composite system.

Abstract: The invention relates to the use of low levels of glycols and short chain diols to control air void formation in any polymerization reaction having carbonyl-containing monomers, and preferably carboxylic acid ester monomers, at a level of at least 10% of total monomer, where the monomer has a peak polymerization exotherm temperature of greater than the boiling point of the monomer. The glycols and short chain diols are used in the polymization mixture at levels of 0.5 to 10 weight percent, based on the carboxylic acid ester-containing monomer. It is believed the glycols and short chain diols hydrogen bond with the —(C?O)O— containing monomer to increase the monomer boiling point, and decrease or even eliminate the formation of air voids due to monomer boiling. The invention is especially useful in polymerization of methyl methacrylate polymers and copolymers, either neat, or as a polymer composite system.

Abstract: An infrared (IR) signature matching system comprises a heating and cooling device, a plurality of sensors configured to detect information related to the IR signature of the heating and cooling device and a background environment, a controller operably coupled with the heating and cooling device and the plurality of sensors. The controller is configured to receive the information from the plurality of sensors and adjust the temperature of the heating and cooling device until the IR signature of the heating and cooling device and the IR signature of the background environment are at least substantially matched in a selectable sub-region of the IR spectrum. Other systems, control circuits and related methods for matching IR signatures and cloaking objects in the IR spectrum are disclosed herein.

Abstract: An infrared (IR) signature matching system comprises a heating and cooling device, a plurality of sensors configured to detect information related to the IR signature of the heating and cooling device and a background environment, a controller operably coupled with the heating and cooling device and the plurality of sensors. The controller is configured to receive the information from the plurality of sensors and adjust the temperature of the heating and cooling device until the IR signature of the heating and cooling device and the IR signature of the background environment are at least substantially matched in a selectable sub-region of the IR spectrum. Other systems, control circuits and related methods for matching IR signatures and cloaking objects in the IR spectrum are disclosed herein.