Abstract: A cage for containing a liquid immersible computer hardware component includes a base portion and two elongate portions extending in a depth direction from the base portion. The elongate portions define a socket adjacent to the base portion in the depth direction and between the elongate portions in a lateral direction. The base portion defines a depth extension below the socket in the depth direction and the elongate portions define lateral extensions on either side of the socket. The cage also includes a power adaptor for conveying power from an intake at an outer edge of the cage to the component when the component is received in the socket.

Abstract: A cage for containing a liquid immersible computer hardware component includes a base portion and two elongate portions extending in a depth direction from the base portion. The elongate portions define a socket adjacent to the base portion in the depth direction and between the elongate portions in a lateral direction. The base portion defines a depth extension below the socket in the depth direction and the elongate portions define lateral extensions on either side of the socket. The cage also includes a power adaptor for conveying power from an intake at an outer edge of the cage to the component when the component is received in the socket.

Abstract: A gantry crane for attachment to an immersion cooling system includes rails attachable to a tank of the immersion cooling system. The gantry also includes a collapsible frame configured to travel along the rails. A connector is adapted for connecting to a computer hardware component intended to be cooled in the immersion cooling system, and the gantry includes a winch mounted to the frame and configured to raise and lower the connector.

Abstract: Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.

Abstract: Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.