Patents by Inventor Evan Fraisse

Evan Fraisse has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular and Collapsible Server Lift Assist for Immersion Cooling System
    Publication number: 20230322528
    Abstract: A gantry crane for attachment to an immersion cooling system includes rails attachable to a tank of the immersion cooling system. The gantry also includes a collapsible frame configured to travel along the rails. A connector is adapted for connecting to a computer hardware component intended to be cooled in the immersion cooling system, and the gantry includes a winch mounted to the frame and configured to raise and lower the connector.
    Type: Application
    Filed: April 6, 2022
    Publication date: October 12, 2023
    Inventors: Jerry Chiu, Evan Fraisse
  • Impinging jet manifold for chip cooling near edge jets
    Patent number: 11310937
    Abstract: Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: April 19, 2022
    Assignee: Google LLC
    Inventors: Jeremy Rice, Jeffrey Scott Spaulding, Evan Fraisse
  • Impinging Jet Manifold For Chip Cooling Near Edge Jets
    Publication number: 20210378139
    Abstract: Systems and methods for chip cooling with near edge jets in a direct liquid cooled module are disclosed. One of the functions of a direct liquid cooled module is to provide cooling liquid to components located on a chip. Jet impingement directly onto the back side of a chip is one cooling method that can provide more efficient cooling. An orifice plate includes an array of small diameter holes that correspond to high velocity jet locations and large diameter holes for the insertion of tubes to connect to lower pressure cavities.
    Type: Application
    Filed: May 29, 2020
    Publication date: December 2, 2021
    Inventors: Jeremy Rice, Jeffrey Scott Spaulding, Evan Fraisse