Patents by Inventor Evan George Colgan

Evan George Colgan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10249516
    Abstract: Arrays of objects on a substrate having void-free underfill as well as methods and systems of forming the same include forming a void-free layer of underfill material between a substrate and an array of multiple objects positioned on the substrate. The void-free layer of underfill material is cured to form a protective cured underfill layer that provides structural support to connections between the objects and the substrate.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: April 2, 2019
    Assignee: International Business Machines Corporation
    Inventors: Evan George Colgan, Michael Anthony Gaynes, Katsuyuki Sakuma, Donald Alan Merte
  • Publication number: 20180076113
    Abstract: Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.
    Type: Application
    Filed: September 15, 2016
    Publication date: March 15, 2018
    Inventors: Thomas J. Brunschwiler, Timothy Joseph Chainer, Evan George Colgan, Michael Anthony Gaynes, Jeffrey Donald Gelorme, Gerard McVicker, Ozgur Ozsun, Pritish Ranjan Parida, Mark Delorman Schultz, Bucknell C. Webb
  • Patent number: 9852960
    Abstract: Arrays of objects on a substrate having void-free underfill as well as methods and systems of forming the same include forming a void-free layer of underfill material between a substrate and an array of multiple objects positioned on the substrate. The void-free layer of underfill material is cured to form a protective cured underfill layer that provides structural support to connections between the objects and the substrate.
    Type: Grant
    Filed: March 17, 2016
    Date of Patent: December 26, 2017
    Assignee: International Business Machines Corporation
    Inventors: Evan George Colgan, Michael Anthony Gaynes, Katsuyuki Sakuma, Donald Alan Merte
  • Publication number: 20170309538
    Abstract: Arrays of objects on a substrate having void-free underfill as well as methods and systems of forming the same include forming a void-free layer of underfill material between a substrate and an array of multiple objects positioned on the substrate. The void-free layer of underfill material is cured to form a protective cured underfill layer that provides structural support to connections between the objects and the substrate.
    Type: Application
    Filed: July 7, 2017
    Publication date: October 26, 2017
    Inventors: Evan George Colgan, Michael Anthony Gaynes, Katsuyuki Sakuma, Donald Alan Merte
  • Publication number: 20170271232
    Abstract: Arrays of objects on a substrate having void-free underfill as well as methods and systems of forming the same include forming a void-free layer of underfill material between a substrate and an array of multiple objects positioned on the substrate. The void-free layer of underfill material is cured to form a protective cured underfill layer that provides structural support to connections between the objects and the substrate.
    Type: Application
    Filed: March 17, 2016
    Publication date: September 21, 2017
    Inventors: Evan George Colgan, Michael Anthony Gaynes, Katsuyuki Sakuma, Donald Alan Merte
  • Patent number: 9342121
    Abstract: Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.
    Type: Grant
    Filed: April 3, 2009
    Date of Patent: May 17, 2016
    Assignee: International Business Machines Corporatoin
    Inventors: William James Anderl, Evan George Colgan, James Dorance Gerken, Christopher Michael Marroquin, Shurong Tian
  • Patent number: 9272498
    Abstract: Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.
    Type: Grant
    Filed: July 11, 2012
    Date of Patent: March 1, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Evan George Colgan, Paul W. Coteus, Michael Anthony Gaynes, Kenneth Charles Marston, Steven P. Ostrander
  • Patent number: 9213378
    Abstract: Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: December 15, 2015
    Assignee: International Business Machines Corporation
    Inventors: William James Anderl, Evan George Colgan, James Dorance Gerken, Christopher Michael Marroquin, Shurong Tian
  • Patent number: 9111925
    Abstract: An enhanced 3D integration structure comprises a logic microprocessor chip bonded to a collection of vertically stacked memory slices and an optional set of outer vertical slices comprising optoelectronic devices. Such a device enables both high memory content in close proximity to the logic circuits and a high bandwidth for logic to memory communication. Additionally, the provision of optoelectronic devices in the outer slices of the vertical slice stack enables high bandwidth direct communication between logic processor chips on adjacent enhanced 3D modules mounted next to each other or on adjacent packaging substrates. A method to fabricate such structures comprises using a template assembly which enables wafer format processing of vertical slice stacks.
    Type: Grant
    Filed: August 23, 2013
    Date of Patent: August 18, 2015
    Assignee: International Business Machines Corporation
    Inventors: Evan George Colgan, SAmpath Purushothaman, Roy R. Yu
  • Patent number: 8772927
    Abstract: Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: July 8, 2014
    Assignee: International Business Machines Corporation
    Inventors: Raschid Jose Bezama, Evan George Colgan, Michael Gaynes, John Harold Magerlein, Kenneth C. Marston, Xiaojin Wei
  • Publication number: 20130341791
    Abstract: An enhanced 3D integration structure comprises a logic microprocessor chip bonded to a collection of vertically stacked memory slices and an optional set of outer vertical slices comprising optoelectronic devices. Such a device enables both high memory content in close proximity to the logic circuits and a high bandwidth for logic to memory communication. Additionally, the provision of optoelectronic devices in the outer slices of the vertical slice stack enables high bandwidth direct communication between logic processor chips on adjacent enhanced 3D modules mounted next to each other or on adjacent packaging substrates. A method to fabricate such structures comprises using a template assembly which enables wafer format processing of vertical slice stacks.
    Type: Application
    Filed: August 23, 2013
    Publication date: December 26, 2013
    Applicant: International Bushiness Machines Corporation
    Inventors: Evan George Colgan, Sampath Purushothaman, Roy R. Yu
  • Patent number: 8505617
    Abstract: A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: August 13, 2013
    Assignee: International Business Machines Corporation
    Inventors: Raschid Jose Bezama, Evan George Colgan, Madhusudan K. Iyengar, John Harold Magerlein, Roger Ray Schmidt
  • Patent number: 8418751
    Abstract: A cooler includes a base layer, a cooling layer including at least one inlet slot and at least one outlet slot for flowing a coolant across a cooling structure including a plurality of staggered fins arranged in rows and columns, wherein fins of adjacent columns are staggered, and at least one manifold layer disposed on the cooling layer for flowing the coolant from a cooler inlet to the at least inlet slot and from the at least one outlet slot to a cooler outlet, the at least one manifold layer having a top layer comprising the cooler inlet and the cooler outlet.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: April 16, 2013
    Assignee: International Business Machines Corporation
    Inventors: Raschid Jose Bezama, Evan George Colgan, John Harold Magerlein
  • Publication number: 20120276375
    Abstract: Precast curable thermal interface adhesives facilitating the easy and repeatable separation and remaining of electronic components at thermal interfaces thereof, and a method for implementing the foregoing repeatable separation and remating at the thermal interfaces of components through the use of such adhesives.
    Type: Application
    Filed: July 11, 2012
    Publication date: November 1, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Evan George Colgan, Paul W. Coteus, Michael Anthony Gaynes, Kenneth Charles Marston, Steven P. Ostrander
  • Publication number: 20120175100
    Abstract: A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.
    Type: Application
    Filed: March 19, 2012
    Publication date: July 12, 2012
    Applicant: International Business Machines Corporation
    Inventors: Raschid Jose Bezama, Evan George Colgan, Madhusudan K. Iyengar, John Harold Magerlein, Roger Ray Schmidt
  • Patent number: 8210243
    Abstract: A cooler having a unitary construction including a channel portion including a plurality of fins on a base, the plurality of fins defining a plurality of microchannels therebetween, a tapered opening formed in a set of the plurality of fins, a manifold portion disposed on an edge portion of the base, the manifold portion including an inlet port and an outlet port disposed above the tapered opening in the plurality of fins, and a separator sheet including at least two elongated openings disposed between the channel portion and the manifold portion.
    Type: Grant
    Filed: July 21, 2008
    Date of Patent: July 3, 2012
    Assignee: International Business Machines Corporation
    Inventors: Raschid Jose Bezama, Evan George Colgan, Madhusudan K. Iyengar, John Harold Magerlein, Roger Ray Schmidt
  • Publication number: 20120049341
    Abstract: Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.
    Type: Application
    Filed: November 7, 2011
    Publication date: March 1, 2012
    Applicant: International Business Machines Corporation
    Inventors: Raschid Jose Bezama, Evan George Colgan, Michael Gaynes, John Harold Magerlein, Kenneth C. Marston, Xiaojin Wei
  • Patent number: 8115303
    Abstract: Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.
    Type: Grant
    Filed: May 13, 2008
    Date of Patent: February 14, 2012
    Assignee: International Business Machines Corporation
    Inventors: Raschid Jose Bezama, Evan George Colgan, Michael Gaynes, John Harold Magerlein, Kenneth C. Marston, Xiaojin Wei
  • Patent number: 8081473
    Abstract: A cooling apparatus, system and like method for an electronic device includes a plurality of heat producing electronic devices affixed to a wiring substrate. A plurality of heat transfer assemblies each include heat spreaders and thermally communicate with the heat producing electronic devices for transferring heat from the heat producing electronic devices to the heat transfer assemblies. The plurality of heat producing electronic devices and respective heat transfer assemblies are positioned on the wiring substrate having the regions overlapping. A heat conduit thermally communicates with the heat transfer assemblies. The heat conduit circulates thermally conductive fluid therethrough in a closed loop for transferring heat to the fluid from the heat transfer assemblies via the heat spreader.
    Type: Grant
    Filed: August 4, 2008
    Date of Patent: December 20, 2011
    Assignee: International Business Machines Corporation
    Inventors: Thomas M. Cipolla, Evan George Colgan, Paul W. Coteus, Shawn Anthony Hall, Shurong Tian
  • Patent number: 8002477
    Abstract: Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.
    Type: Grant
    Filed: August 1, 2008
    Date of Patent: August 23, 2011
    Assignee: International Business Machines Corporation
    Inventors: Evan George Colgan, Fuad Elias Doany, Bruce Kenneth Furman, Daniel J. Stigliani, Jr.