Abstract: Memory devices and systems with post-packaging master die selection, and associated methods, are disclosed herein. In one embodiment, a memory device includes a plurality of memory dies. Each memory die of the plurality includes a command/address decoder. The command/address decoders are configured to receive command and address signals from external contacts of the memory device. The command/address decoders are also configured, when enabled, to decode the command and address signals and transmit the decoded command and address signals to every other memory die of the plurality. Each memory die further includes circuitry configured to enable, or disable, or both individual command/address decoders of the plurality of memory dies. In some embodiments, the circuitry can enable a command/address decoder of a memory die of the plurality after the plurality of memory dies are packaged into a memory device.

Abstract: An electro-optical payload for free space optical communication includes: a plurality of optical beam expanders, each for receiving a respective optical signal; an optical cross-connect switch for directing respective optical signals to respective optical output signals; an electrical-to-optical conversion circuit coupled to an input of the optical cross-connect switch for converting an electrical signal to an optical signal for inputting to the optical cross-connect switch; an optical-to-electrical conversion circuit for converting an optical signal output from the optical cross-connect switch to an electrical signal; and an electrical regeneration circuit including a second optical-to-electrical conversion circuit coupled to an output of the optical cross-connect switch and a second electrical-to-optical conversion circuit coupled to an input of the optical cross-connect switch for converting an optical out signal of the optical cross-connect switch to an electrical signal.

Abstract: An electro-optical payload for free space optical communication includes: a plurality of optical beam expanders, each for receiving a respective optical signal of incoming optical signals; an optical cross-connect switch for directing respective optical input signals to respective optical output signals; an electrical-to-optical conversion circuit coupled to an input of the optical cross-connect switch for converting an electrical signal to an optical signal for inputting to the optical cross-connect switch; an optical-to-electrical conversion circuit coupled to an output of the optical cross-connect switch for converting an optical signal output from the optical cross-connect switch to an electrical signal; and an electrical regeneration circuit including a second optical-to-electrical conversion circuit coupled to an output of the optical cross-connect switch and a second electrical-to-optical conversion circuit coupled to an input of the optical cross-connect switch for converting an optical out signal of