Patents by Inventor Evan Kirk

Evan Kirk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-profile sealed surface-mount package
    Patent number: 12512379
    Abstract: A hermetically sealed semiconductor die package having a sidewall structure having a first opening and a second opening; a lid attached to the sidewall structure to hermetically seal the first opening; a substrate attached to the sidewall structure to hermetically seal the second opening, wherein the substrate comprises first, second, and third apertures; a first button attached to the substrate to hermetically seal the first aperture; a second button attached to the substrate to hermetically seal the second aperture; and a third button attached to the substrate to hermetically seal the third aperture.
    Type: Grant
    Filed: August 8, 2022
    Date of Patent: December 30, 2025
    Assignee: Microchip Technology Incorporated
    Inventors: Saeed Shafiyan-Rad, Evan Kirk, David Doiron, Christopher Alan Barnes, Cliff Firth
  • HERMETIC SMD PACKAGE
    Publication number: 20250253196
    Abstract: A device including a substrate having a first aperture, a second aperture and a third aperture. Where a bottom surface of the first and second covers may be bonded to the top surface of substrate to cover the first and second apertures, respectively, and with first and second leads bonded to the bottom surface of the first and second covers, respectively, so the first and second leads extend through the first and second apertures, respectively. The top surface of a third cover may be bonded to the bottom surface of the substrate to cover the third aperture. The bottom portion of a seal ring may be bonded to the top portion of the substrate to surround the first, second, and third apertures, and a cap may be bonded to the top portion of the seal ring. The components may be bonded to create hermetic seals for an SMD package.
    Type: Application
    Filed: April 15, 2024
    Publication date: August 7, 2025
    Applicant: Microchip Technology Incorporated
    Inventors: Saeed Shafiyan-rad, Thomas Doughty, Evan Kirk
  • LOW-PROFILE SEALED SURFACE-MOUNT PACKAGE
    Publication number: 20230360990
    Abstract: A hermetically sealed semiconductor die package having a sidewall structure having a first opening and a second opening; a lid attached to the sidewall structure to hermetically seal the first opening; a substrate attached to the sidewall structure to hermetically seal the second opening, wherein the substrate comprises first, second, and third apertures; a first button attached to the substrate to hermetically seal the first aperture; a second button attached to the substrate to hermetically seal the second aperture; and a third button attached to the substrate to hermetically seal the third aperture.
    Type: Application
    Filed: August 8, 2022
    Publication date: November 9, 2023
    Applicant: Microchip Technology Incorporated
    Inventors: Saeed Shafiyan-Rad, Evan Kirk, David Doiron, Christopher Alan Barnes