Patent number: 12284793
Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
Type:
Grant
Filed:
December 23, 2020
Date of Patent:
April 22, 2025
Assignee:
Intel Corporation
Inventors:
Ritu Bawa, Ruander Cardenas, Kathiravan D, Jia Yan Go, Chin Kung Goh, Jeff Ku, Prakash Kurma Raju, Baomin Liu, Twan Sing Loo, Mikko Makinen, Columbia Mishra, Juha Paavola, Prasanna Pichumani, Daniel Ragland, Kannan Raja, Khal Ern See, Javed Shaikh, Gokul Subramaniam, George Baoci Sun, Xiyong Tian, Hua Yang, Mark Carbone, Vivek Paranjape, Nehakausar Pinjari, Hari Shanker Thakur, Christopher Moore, Gustavo Fricke, Justin Huttula, Gavin Sung, Sammi Wy Liu, Arnab Sen, Chun-Ting Liu, Jason Y. Jiang, Gerry Juan, Shih Wei Nien, Lance Lin, Evan Kuklinski
Publication number: 20230337406
Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
Type:
Application
Filed:
December 23, 2020
Publication date:
October 19, 2023
Inventors:
Ritu BAWA, Ruander CARDENAS, Kathiravan D, Jia Yan GO, Chin Kung GOH, Jeff KU, Prakash Kurma RAJU, Baomin LIU, Twan Sing LOO, Mikko MAKINEN, Columbia MISHRA, Juha PAAVOLA, Prasanna PICHUMANI, Daniel RAGLAND, Kannan RAJA, Khai Ern SEE, Javed SHAIKH, Gokul SUBRAMANIAM, George Baoci SUN, Xiyong TIAN, Hua YANG, Mark CARBONE, Vivek PARANJAPE, Nehakausar PINJARI, Hari Shanker THAKUR, Christopher MOORE, Gustavo FRICKE, Justin HUTTULA, Gavin SUNG, Sammi WY LIU, Arnab SEN, Chun-Ting LIU, Jason Y. JIANG, Gerry JUAN, Shih Wei NIEN, Lance LIN, Evan KUKLINSKI