Patents by Inventor Evan M. Smith

Evan M. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11972298
    Abstract: Technologies for migrating data between edge accelerators hosted on different edge locations include a device hosted on a present edge location. The device includes one or more processors to: receive a workload from a requesting device, determine one or more accelerator devices hosted on the present edge location to perform the workload, and transmit the workload to the one or more accelerator devices to process the workload. The one or more processor is further to determine whether to perform data migration from the one or more accelerator devices to one or more different edge accelerator devices hosted on a different edge location, and send, in response to a determination to perform the data migration, a request to the one or more accelerator devices on the present edge location for transformed workload data to be processed by the one or more different edge accelerator devices.
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Evan Custodio, Francesc Guim Bernat, Suraj Prabhakaran, Trevor Cooper, Ned M. Smith, Kshitij Doshi, Petar Torre
  • Patent number: 11972001
    Abstract: Technologies for securely providing one or more remote accelerators hosted on edge resources to a client compute device includes a device that further includes an accelerator and one or more processors. The one or more processors are to determine whether to enable acceleration of an encrypted workload, receive, via an edge network, encrypted data from a client compute device, and transfer the encrypted data to the accelerator without exposing content of the encrypted data to the one or more processors. The accelerator is to receive, in response to a determination to enable the acceleration of the encrypted workload, an accelerator key from a secure server via a secured channel, and process, in response to a transfer of the encrypted data from the one or more processors, the encrypted data using the accelerator key.
    Type: Grant
    Filed: May 13, 2022
    Date of Patent: April 30, 2024
    Assignee: Intel Corporation
    Inventors: Ned M. Smith, Brinda Ganesh, Francesc Guim Bernat, Eoin Walsh, Evan Custodio
  • Patent number: 11543571
    Abstract: A transmission filter apparatus is provided that includes: (i) a substrate to serve as a foundation for the apparatus; (ii) a layer containing resonant dielectric cavities separated by conductive regions. The dimensions and design of the dielectric cavities, thickness of the layer, and substrate, dielectric and conductive materials are chosen to achieve resonant transmission of selected wavelengths. In a particular one or more embodiments, the layer is one dimensional, i.e. you have dielectric cavities along one axis in the plane that are comparatively infinity long in the parallel plane. In a particular one or more embodiments, the layer is two dimensional, i.e. you have dielectric cavities along both axis in the plane. The dimensions in each plane may or may not be equal. In a specific one or more embodiments, the dielectric cavities are terminated on the top and/or bottom by thin metal films with small apertures or tapers.
    Type: Grant
    Filed: June 16, 2020
    Date of Patent: January 3, 2023
    Assignee: United States of America as represented by the Secretary of the Air Force
    Inventors: Justin W. Cleary, Evan M. Smith, Ricky D. Gibson, Jr., Shivashankar R. Vangala, Joshua Hendrickson, Ivan Avrutsky
  • Publication number: 20210041612
    Abstract: A transmission filter apparatus is provided that includes: (i) a substrate to serve as a foundation for the apparatus; (ii) a layer containing resonant dielectric cavities separated by conductive regions. The dimensions and design of the dielectric cavities, thickness of the layer, and substrate, dielectric and conductive materials are chosen to achieve resonant transmission of selected wavelengths. In a particular one or more embodiments, the layer is one dimensional, i.e. you have dielectric cavities along one axis in the plane that are comparatively infinity long in the parallel plane. In a particular one or more embodiments, the layer is two dimensional, i.e. you have dielectric cavities along both axis in the plane. The dimensions in each plane may or may not be equal. In a specific one or more embodiments, the dielectric cavities are terminated on the top and/or bottom by thin metal films with small apertures or tapers.
    Type: Application
    Filed: June 16, 2020
    Publication date: February 11, 2021
    Inventors: Justin W. Cleary, Evan M. Smith, Ricky D. Gibson, Shivashankar R. Vangala, Joshua Hendrickson, Ivan Avrutsky