Abstract: A bait station having an enclosed housing defining an internal volume is disclosed, wherein the internal volume is divided by a partition wall defining a main chamber and an electronics compartment. The electronics compartment has a wireless communication module including a computer processor and transceiver. The main chamber has a single access for a targeted type of pest and a bait access door. A bait platform is located within the main chamber, and a bait monitoring sensor is also located within the main chamber. The bait monitoring sensor is communicatively coupled with the wireless communication module.

Abstract: A bait station having an enclosed housing defining an internal volume is disclosed, wherein the internal volume is divided by a partition wall defining a main chamber and an electronics compartment. The electronics compartment has a wireless communication module including a computer processor and transceiver. The main chamber has a single access for a targeted type of pest and a bait access door. A bait platform is located within the main chamber, and a bait monitoring sensor is also located within the main chamber. The bait monitoring sensor is communicatively coupled with the wireless communication module.

Abstract: A bait station having an enclosed housing defining an internal volume is disclosed, wherein the internal volume is divided by a partition wall defining a main chamber and an electronics compartment. The electronics compartment has a wireless communication module including a computer processor and transceiver. The main chamber has a single access for a targeted type of pest and a bait access door. A bait platform is located within the main chamber, and a bait monitoring sensor is also located within the main chamber. The bait monitoring sensor is communicatively coupled with the wireless communication module.

Abstract: A bait station having an enclosed housing defining an internal volume is disclosed, wherein the internal volume is divided by a partition wall defining a main chamber and an electronics compartment. The electronics compartment has a wireless communication module including a computer processor and transceiver. The main chamber has a single access for a targeted type of pest and a bait access door. A bait platform is located within the main chamber, and a bait monitoring sensor is also located within the main chamber. The bait monitoring sensor is communicatively coupled with the wireless communication module.

Abstract: The invention relates to a system capable of electronically matching transportation reservations with existing, new, or potential reservations, so that the orders can be combined, the reservation shared between requesting parties, utilization and management of transportation provider inventory and costs can be optimized, and savings opportunities for customers may be provided. Costs may also be divided proportionally based on a combination of distance and/or time traveled, or other cost accrual methods per riding party, and split/billed electronically via the reservation system. The system can operate as a standalone reservation repository or in concert with one or many existing reservation providers.

Abstract: The invention relates to a system capable of electronically matching transportation reservations with existing, new, or potential reservations, so that the orders can be combined, the reservation shared between requesting parties, utilization and management of transportation provider inventory and costs can be optimized, and savings opportunities for customers may be provided. Costs may also be divided proportionally based on a combination of distance and/or time traveled, or other cost accrual methods per riding party, and split/billed electronically via the reservation system. The system can operate as a standalone reservation repository or in concert with one or many existing reservation providers.

Abstract: An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.

Abstract: An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.

Abstract: An encapsulant for use with opto-electronic devices and optical components incorporates a filler made from a glass that has been processed into particle form and heated to a predetermined temperature for a predetermined time, along with an epoxy having an index of refraction matched to that of the glass and heated to a predetermined temperature for a predetermined time, to prevent settling of the filler particles after mixing the filler particles with the epoxy, and thereby obtaining uniform dispersion of the particles within the epoxy. The encapsulant provides for high light transmittance, and its coefficient of thermal expansion can be varied by varying the amount of filler without substantially altering the optical properties of the encapsulant. The coefficient of thermal expansion variation within the encapsulant preferably is less than 30%, due to uniform dispersion of the filler particles within the epoxy.