Abstract: Method of manufacturing a microfluidic device comprising an inflexible polymeric substrate, one or more flexible polymeric substrate(s) and one or more microfluidic channel(s) enclosed between the substrates comprising a) providing a master form including rim protrusions defining an enveloping shape for the microfluidic channel(s) to be produced and enclosed between the substrates, b) placing one or more flexible polymeric substrate(s) each having a layer thickness of less than 800 ?m onto the master form, wherein one flexible polymeric substrate is in contact with the rim protrusions of the master form, c) placing an inflexible polymeric substrate with a layer thickness of equal to or more than 800 ?m onto the flexible polymeric substrate(s), and d) ultrasonically welding the one or more flexible polymeric substrate(s) and the inflexible polymeric substrate at the rim protrusions. By the inventive method microfluidic devices via ultrasonic welding without using energy directors can be obtained.

Abstract: The present disclosure relates to a method of forming a coating on a blade for a shaver, the method comprising: a first step of evaporating a portion of a supply of a lubricating coating material in a negative pressure chamber, wherein the blade is positioned in the negative pressure chamber adjacent to the supply of the lubricating coating material such that the portion of the lubricating coating material evaporates from the supply and coats the blade; a second step, performed after the first step, of sintering the portion of the lubricating coating material coating the blade by heating the blade to a temperature above the melting temperature of the lubricating coating material; and a third step, performed after the second step, of cooling the blade after sintering to a room temperature.

Abstract: This invention presents a method for the fabrication of periodic nanostructures on polymeric surfaces by means of plasma processing, which method comprises the following steps: (i) provision of a homogeneous organic polymer (such as PMMA, or PET, or PEEK, or PS, or PE, or COC) or inorganic polymer (such as PDMS or ORMOCER); (ii) exposure of the polymer to an etching plasma such as oxygen (O2) or sulphur hexafluoride (SF6) or a mixture of oxygen (O2) and sulphur hexafluoride (SF6), or mixtures of etching gases with inert gases such as any Noble gas (Ar, He, Ne, Xe).

Abstract: The present invention refers to new organic molecules, derived from the class of polycarbocycle derivatives, and their application as components of photoresists, and in particular as components of photoresist compositions where no polymer is comprised as one of the photoresists components. In these photoresist formulations the new molecule(s) is/are the main component(s) (i.e. percentage higher than 50% w/w).

Abstract: This invention presents a method for the fabrication of periodic nanostructures on polymeric surfaces by means of plasma processing, which method comprises the following steps: (i) provision of a homogeneous organic polymer (such as PMMA, or PET, or PEEK, or PS, or PE, or COC) or inorganic polymer (such as PDMS or ORMOCER); (ii) exposure of the polymer to an etching plasma such as oxygen (O2) or sulphur hexafluoride (SF6) or a mixture of oxygen (O2) and sulphur hexafluoride (SF6), or mixtures of etching gases with inert gases such as any Noble gas (Ar, He, Ne, Xe).

Abstract: This invention provides a method for protein patterning and fabrication of biomolecule microarrays, based on the selective biomolecule adsorption on hydrophilic versus hydrophobic patterns created by selective plasma deposition of fluorocarbon film.

Abstract: The present invention refers to new organic molecules, derived from the class of polycarbocycle derivatives, and their application as components of photoresists, and in particular as components of photoresist compositions where no polymer is comprised as one of the photoresists components. In these photoresist formulations the new molecule(s) is/are the main component(s) (i.e. percentage higher than 50% w/w).

Abstract: Mixed carbocycle derivatives containing at least two carbocycles per molecule from the group of anthracenes, adamantanes and steroids with functionalized carbon chains are synthesized and used as modifiers of resist properties and especially etch resistance enhancement and absorption characteristics. These derivatives are characterized by formulas I-V, where A and R may be an anthryl- and/or an adamantyl- and/or a steroid moiety. Methods for the preparation of the above compounds are disclosed.

Abstract: Materials are described suitable for optical lithography in the ultraviolet region (including 157 nm and extreme ultraviolet region), and for electron beam lithography. These materials are based on new homopolymers and copolymers, they are characterized by the presence of polyhedral oligomeric silsequioxanes in their molecule, and they are suitable for single as well as bilayer lithography. Ethyl, or similar or smaller size, groups are used as alkyl substituents of the silsequioxanes in order to reduce problems related to pattern transfer, roughness, and high absorbance at 157 nm (such problems occur when the substituents are large alkyl groups such as cyclopentyl groups).

Abstract: Mixed carbocycle derivatives containing at least two carbocycles per molecule from the group of anthracenes, adamantanes and steroids with functionalized carbon chains are synthesized and used as modifiers of resist properties and especially etch resistance enhancement and absorption characteristics. These derivatives are characterized by formulas I-V, where A and R may be an anthryl- and/or an adamantyl- and/or a steroid moiety. Methods for the preparation of the above compounds are disclosed.

Abstract: A high resolution pattern transfer processes is described, whereby epoxy containing photoresist films are imagewise exposed to radiation, baked to crosslink the exposed areas, and treated with a silylating medium, which reacts with the epoxy ring thereby incorporating silicon at will in the non-crosslinked regions of the film, while making those regions resistant to oxygen atom-containing plasmas.