Patents by Inventor Evans S. McCarthy

Evans S. McCarthy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadless chip carrier for reduced thermal resistance
    Patent number: 6787895
    Abstract: According to one embodiment, a semiconductor die is situated in a cutout section of a substrate. In one embodiment, the substrate is situated on a printed circuit board such that the semiconductor die situated in the cutout section of the substrate is also situated on a support pad on the top surface of the printed circuit board. In one embodiment, a semiconductor die bond pad on the semiconductor die is connected to a substrate bond pad on the substrate. In one embodiment, an interconnect trace on the substrate is connected to an interconnect pad on the top surface of the printed circuit board.
    Type: Grant
    Filed: December 7, 2001
    Date of Patent: September 7, 2004
    Assignee: Skyworks Solutions, Inc.
    Inventors: Michael J. Jarcy, Andrew R. Gizara, Evans S. McCarthy, Robbie U. Villanueva, Hassan S. Hashemi, Mahyar S. Dadkhah