Abstract: A light-emitting component is provided including a functional layer stack having at least one light-emitting layer which is set up to generate light during the operation of the component, a first electrode and a second electrode, which are set up to inject charge carriers into the functional layer stack during operation, and an encapsulation arrangement having encapsulation material, which is arranged above at least one of the electrodes and the functional layer stack. At least one of the electrodes is transparent and contains a wavelength conversion substance and/or the encapsulation material is transparent and contains a wavelength conversion substance.

Abstract: The invention relates to an optoelectronic component (100) comprising an organic light emitting diode (1) designed for emitting radiation and/or heat, a substrate (2), on which the organic light emitting diode is arranged, wherein the substrate (2) comprises a first substrate material (21) and at least one substrate cavity (22) which is filled with a second substrate material (23) different than the first substrate material (21), wherein the second substrate material (23) is designed to dissipate the heat emitted by the organic light emitting diode (1).

Abstract: According to the present disclosure, a method for producing an optoelectronic component is provided. The method includes forming an optically functional layer structure in accordance with at least one part of a geometric network of a body, and bending the part of the geometric network in the at least one desired bending region, such that at least one part of the body is formed. The part of the geometric network includes at least one desired bending region.

Abstract: A light-emitting component is provided including a functional layer stack having at least one light-emitting layer which is set up to generate light during the operation of the component, a first electrode and a second electrode, which are set up to inject charge carriers into the functional layer stack during operation, and an encapsulation arrangement having encapsulation material, which is arranged above at least one of the electrodes and the functional layer stack. At least one of the electrodes is transparent and contains a wavelength conversion substance and/or the encapsulation material is transparent and contains a wavelength conversion substance.

Abstract: An organic optoelectronic component includes a first electrode which is made of an electrically conductive material, an active region which is made of an organic material, a second electrode which is made of an electrically conductive material, an encapsulating layer sequence which is made of a dielectric material, and a third electrode which is made of an electrically conductive material. The first electrode and the second electrode are arranged on different sides of the active region. The encapsulating layer sequence is arranged between the first electrode and the third electrode. The first electrode, the second electrode, and the third electrode can be contacted from outside the component.

Abstract: Various embodiments may relate to an optoelectronic component, including a carrier, a planar, electrically active region on or above the carrier; an adhesion layer on or above the electrically active region, wherein the adhesion layer at least partly surrounds the electrically active region, a cover on or above the adhesion layer, wherein a part of the adhesion layer is exposed, and an encapsulation on or above the exposed adhesion layer, wherein the encapsulation is formed from an inorganic substance or substance mixture. Further various embodiments may relate to a method for producing an optoelectronic component.

Abstract: An organic electronic device and a method of making an organic electronic device are provided. An embodiment of an electronic device includes a substrate, an active layer disposed on the substrate and a thin-layer encapsulation disposed on the active layer. The device further includes a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material and a covering layer disposed on the first adhesive layer.

Abstract: The invention relates to an optoelectronic component (100) comprising an organic light emitting diode (1) designed for emitting radiation and/or heat, a substrate (2), on which the organic light emitting diode is arranged, wherein the substrate (2) comprises a first substrate material (21) and at least one substrate cavity (22) which is filled with a second substrate material (23) different than the first substrate material (21), wherein the second substrate material (23) is designed to dissipate the heat emitted by the organic light emitting diode (1).

Abstract: An organic optoelectronic component includes a first electrode which is made of an electrically conductive material, an active region which is made of an organic material, a second electrode which is made of an electrically conductive material, an encapsulating layer sequence which is made of a dielectric material, and a third electrode which is made of an electrically conductive material. The first electrode and the second electrode are arranged on different sides of the active region. The encapsulating layer sequence is arranged between the first electrode and the third electrode. The first electrode, the second electrode, and the third electrode can be contacted from outside the component.

Abstract: An organic optoelectronic component may include at least one contact pad with a first electrical contact region and a second electrical contact region. The first electrical contact region and the second electrical contact region are electrically connected to the contact pad. The second electrical contact region is designed in such a way that it has a higher adhesion than the first electrical contact region in respect of a cohesive connection means with the contact pad. The contact pad is designed in such a way that the first electrical contact region is free of cohesive connection means.

Abstract: Various embodiments may relate to an optoelectronic component, including a carrier, a planar, electrically active region on or above the carrier; an adhesion layer on or above the electrically active region, wherein the adhesion layer at least partly surrounds the electrically active region, a cover on or above the adhesion layer, wherein a part of the adhesion layer is exposed, and an encapsulation on or above the exposed adhesion layer, wherein the encapsulation is formed from an inorganic substance or substance mixture. Further various embodiments may relate to a method for producing an optoelectronic component.

Abstract: Various embodiments may relate to an electronic component including a layer to be protected against moisture, and a moisture barrier layer arranged at least partly on or above and/or below the layer to be protected. The moisture bather layer includes a plurality of layers composed of the same material having different stoichiometric compositions.

Abstract: An organic electronic device and a method of making an organic electronic device are provided. An embodiment of an electronic device includes a substrate, an active layer disposed on the substrate and a thin-layer encapsulation disposed on the active layer. The device further includes a first adhesive layer disposed on the thin-layer encapsulation, wherein the first adhesive layer comprises a getter material and a covering layer disposed on the first adhesive layer.