Patents by Inventor Everett D. Smith

Everett D. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Oscillating orbital polisher and method
    Patent number: 6500055
    Abstract: A method and apparatus for improving uniformity of the rate of removal of material from the surface of a semiconductor substrate by chemical mechanical polishing. In accordance with the invention, the semiconductor substrate is subjected to a combination of polishing motions, including orbital motion, and at least one additional polishing motion selected from rotational, oscillating, sweeping, and linear polishing motions. The invention also provides an improved method for conditioning polishing pads to provide more uniform conditioning and to extend their useful life span.
    Type: Grant
    Filed: September 18, 2000
    Date of Patent: December 31, 2002
    Assignee: SpeedFam-IPEC Corporation
    Inventors: John A. Adams, Everett D. Smith, Stephen C. Schultz
  • Oscillating orbital polisher and method
    Patent number: 6184139
    Abstract: A method and apparatus for improving uniformity of the rate of removal of material from the surface of a semiconductor substrate by chemical mechanical polishing. In accordance with the invention, the semiconductor substrate is subjected to a combination of polishing motions, including orbital motion, and at least one additional polishing motion selected from rotational, oscillating, sweeping, and linear polishing motions. The invention also provides an improved method for conditioning polishing pads to provide more uniform conditioning and to extend their useful life span.
    Type: Grant
    Filed: September 17, 1998
    Date of Patent: February 6, 2001
    Assignee: SpeedFam-IPEC Corporation
    Inventors: John A. Adams, Everett D. Smith, Stephen C. Schultz
  • Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly
    Patent number: 6143155
    Abstract: Simultaneous non-contact plating and planarizing of copper interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode and a metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.
    Type: Grant
    Filed: June 11, 1998
    Date of Patent: November 7, 2000
    Assignee: SpeedFam IPEC Corp.
    Inventors: John A. Adams, Gerald A. Krulik, Everett D. Smith
  • Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly
    Patent number: 6132586
    Abstract: Plating of metal interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode assembly a single metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.
    Type: Grant
    Filed: June 11, 1998
    Date of Patent: October 17, 2000
    Assignee: Integrated Process Equipment Corporation
    Inventors: John A. Adams, Gerald A. Krulik, Everett D. Smith
  • Method and apparatus for planarization of metallized semiconductor wafers using a bipolar electrode assembly
    Patent number: 6121152
    Abstract: Planarization of metal interconnections in semiconductor wafer manufacturing is performed by providing relative motion between a bipolar electrode assembly scanned and a single metallized surface of a semiconductor wafer without necessary physical contact with the wafer or direct electrical connection thereto.
    Type: Grant
    Filed: June 11, 1998
    Date of Patent: September 19, 2000
    Assignee: Integrated Process Equipment Corporation
    Inventors: John A. Adams, Gerald A. Krulik, Everett D. Smith
  • Quick assembly catheter manifold
    Patent number: 5507732
    Abstract: The present invention is accomplished by providing a catheter manifold (15) having a manifold catheter lumen (115) extending longitudinally therethrough plus a rotationally symmetrical, conically tapering, elastomeric distal seal (65) for gripping the catheter shaft (70), the proximal end of the distal seal (65) having a smaller diameter than the distal end, the distal end of the manifold catheter lumen (115) being conically tapered and sized for a friction fit with the distal seal (65) when the distal seal (65) is inserted into the distal end of the manifold catheter lumen (115), the distal seal (65) having a longitudinally extending distal seal catheter lumen (120).
    Type: Grant
    Filed: October 5, 1994
    Date of Patent: April 16, 1996
    Assignee: Medtronic, Inc.
    Inventors: Robert W. McClure, Ernie P. Gerstmar, Walter R. Parkola, Matthew S. Gibbons, Everett D. Smith