Patents by Inventor Everett LYONS

Everett LYONS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DATA STORAGE DEVICE ADAPTOR WITH SECUREMENT MECHANISM
    Publication number: 20230180417
    Abstract: In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board. The apparatus also includes a first connector coupled to the printed circuit board. The first connector is configured to couple the apparatus to a computing device. The apparatus further includes a second connector coupled to the printed circuit board. The second connector is configured to couple the apparatus to a data storage device. The apparatus further includes a securement mechanism comprising a first portion and a second portion. The securement mechanism is movable about the apparatus between a first position and a second position. The first portion is configured to maintain the securement mechanism at the first position. The second portion is configured to secure the data storage device to the apparatus when the securement mechanism is in the first position.
    Type: Application
    Filed: January 27, 2023
    Publication date: June 8, 2023
    Inventors: Everett LYONS, Daniel LINNEN, Randy GILLESPIE
  • Data storage device adaptor with securement mechanism
    Patent number: 11570924
    Abstract: In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board. The apparatus also includes a first connector coupled to the printed circuit board. The first connector is configured to couple the apparatus to a computing device. The apparatus further includes a second connector coupled to the printed circuit board. The second connector is configured to couple the apparatus to a data storage device. The apparatus further includes a securement mechanism comprising a first portion and a second portion. The securement mechanism is movable about the apparatus between a first position and a second position. The first portion is configured to maintain the securement mechanism at the first position. The second portion is configured to secure the data storage device to the apparatus when the securement mechanism is in the first position.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: January 31, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: Everett Lyons, Daniel Linnen, Randy Gillespie
  • Semiconductor device including fractured semiconductor dies
    Patent number: 11195820
    Abstract: A fractured semiconductor die is disclosed, together with a semiconductor device including the fractured semiconductor die. During fabrication of the semiconductor dies in a wafer, the wafer may be scored in a series of parallel scribe lines through portions of each row of semiconductor dies. The scribe lines then propagate through the full thickness of the wafer to fracture off a portion of each of the semiconductor dies. It may happen that electrical traces such as bit lines in the memory cell arrays short together during the die fracture process. These electrical shorts may be cleared by running a current through each of the electrical traces.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: December 7, 2021
    Assignee: SanDisk Technologies LLC
    Inventors: Daniel Linnen, Kirubakaran Periyannan, Jayavel Pachamuthu, Narendhiran Cr, Jay Dholakia, Everett Lyons, IV, Hoang Huynh, Dat Dinh
  • Semiconductor device including fractured semiconductor dies
    Patent number: 11139276
    Abstract: A fractured semiconductor die is disclosed, together with a semiconductor device including the fractured semiconductor die. During fabrication of the semiconductor dies in a wafer, the wafer may be scored in a series of parallel scribe lines through portions of each row of semiconductor dies. The scribe lines then propagate through the full thickness of the wafer to fracture off a portion of each of the semiconductor dies. It may happen that electrical traces such as bit lines in the memory cell arrays short together during the die fracture process. These electrical shorts may be cleared by running a current through each of the electrical traces.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: October 5, 2021
    Assignee: SanDisk Technologies LLC
    Inventors: Daniel Linnen, Kirubakaran Periyannan, Jayavel Pachamuthu, Narendhiran Cr, Jay Dholakia, Everett Lyons, IV, Hoang Huynh, Dat Dinh
  • SEMICONDUCTOR DEVICE INCLUDING FRACTURED SEMICONDUCTOR DIES
    Publication number: 20210280559
    Abstract: A fractured semiconductor die is disclosed, together with a semiconductor device including the fractured semiconductor die. During fabrication of the semiconductor dies in a wafer, the wafer may be scored in a series of parallel scribe lines through portions of each row of semiconductor dies. The scribe lines then propagate through the full thickness of the wafer to fracture off a portion of each of the semiconductor dies. It may happen that electrical traces such as bit lines in the memory cell arrays short together during the die fracture process. These electrical shorts may be cleared by running a current through each of the electrical traces.
    Type: Application
    Filed: March 3, 2020
    Publication date: September 9, 2021
    Applicant: SANDISK TECHNOLOGIES LLC
    Inventors: Daniel Linnen, Kirubakaran Periyannan, Jayavel Pachamuthu, Narendhiran CR, Jay Dholakia, Everett Lyons, IV, Hoang Huynh, Dat Dinh
  • DATA STORAGE DEVICE ADAPTOR WITH SECUREMENT MECHANISM
    Publication number: 20210267083
    Abstract: In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board. The apparatus also includes a first connector coupled to the printed circuit board. The first connector is configured to couple the apparatus to a computing device. The apparatus further includes a second connector coupled to the printed circuit board. The second connector is configured to couple the apparatus to a data storage device. The apparatus further includes a securement mechanism comprising a first portion and a second portion. The securement mechanism is movable about the apparatus between a first position and a second position. The first portion is configured to maintain the securement mechanism at the first position. The second portion is configured to secure the data storage device to the apparatus when the securement mechanism is in the first position.
    Type: Application
    Filed: February 24, 2020
    Publication date: August 26, 2021
    Inventors: Everett LYONS, Daniel LINNEN, Randy GILLESPIE