Abstract: Techniques disclosed herein utilize a vision sensor that integrates a special-purpose camera with dedicated computer vision (CV) computation hardware and a dedicated low-power microprocessor for the purposes of detecting, tracking, recognizing, and/or analyzing subjects, objects, and scenes in the view of the camera. The vision sensor processes the information retrieved from the camera using the included low-power microprocessor and sends “events” (or indications that one or more reference occurrences have occurred, and, possibly, associated data) for the main processor only when needed or as defined and configured by the application. This allows the general-purpose microprocessor (which is typically relatively high-speed and high-power to support a variety of applications) to stay in a low-power (e.g., sleep mode) most of the time as conventional, while becoming active only when events are received from the vision sensor.

Abstract: In one aspect, an illumination device with integrated touch sensor capability includes a light guide having a metalized light-turning feature and an electrode system for sensing changes to the capacitance between electrodes in the electrode system induced by the proximity of an electrically conductive body, such as a human finger. The metalized light-turning features may be electrically connected to and/or part of the electrode system.

Abstract: Apparatuses, methods, and systems are presented for reacting to scene-based occurrences. Such an apparatus may comprise dedicated computer vision (CV) computation hardware configured to receive sensor data from a sensor array comprising a plurality of sensor pixels and capable of computing one or more CV features using readings from neighboring sensor pixels of the sensor array. The apparatus may further comprise a first processing unit configured to control operation of the dedicated CV computation hardware. The first processing unit may be further configured to execute one or more application programs and, in conjunction with execution of the one or more application programs, communicate with at least one input/output (I/O) device controller, to effectuate an I/O operation in reaction to an event generated based on operations performed on the one or more computed CV features.

Abstract: Apparatuses, methods, and systems are presented for sensing scene-based occurrences. Such an apparatus may comprise a vision sensor system comprising a first processing unit and dedicated computer vision (CV) computation hardware configured to receive sensor data from at least one sensor array comprising a plurality of sensor pixels and capable of computing one or more CV features using readings from neighboring sensor pixels. The vision sensor system may be configured to send an event to be received by a second processing unit in response to processing of the one or more computed CV features by the first processing unit. The event may indicate possible presence of one or more irises within a scene.

Abstract: Techniques disclosed herein utilize a vision sensor that integrates a special-purpose camera with dedicated computer vision (CV) computation hardware and a dedicated low-power microprocessor for the purposes of detecting, tracking, recognizing, and/or analyzing subjects, objects, and scenes in the view of the camera. The vision sensor processes the information retrieved from the camera using the included low-power microprocessor and sends “events” (or indications that one or more reference occurrences have occurred, and, possibly, associated data) for the main processor only when needed or as defined and configured by the application. This allows the general-purpose microprocessor (which is typically relatively high-speed and high-power to support a variety of applications) to stay in a low-power (e.g., sleep mode) most of the time as conventional, while becoming active only when events are received from the vision sensor.

Abstract: Techniques disclosed herein utilize a vision sensor that integrates a special-purpose camera with dedicated computer vision (CV) computation hardware and a dedicated low-power microprocessor for the purposes of detecting, tracking, recognizing, and/or analyzing subjects, objects, and scenes in the view of the camera. The vision sensor processes the information retrieved from the camera using the included low-power microprocessor and sends “events” (or indications that one or more reference occurrences have occurred, and, possibly, associated data) for the main processor only when needed or as defined and configured by the application. This allows the general-purpose microprocessor (which is typically relatively high-speed and high-power to support a variety of applications) to stay in a low-power (e.g., sleep mode) most of the time as conventional, while becoming active only when events are received from the vision sensor.

Abstract: Techniques disclosed herein utilize a vision sensor that integrates a special-purpose camera with dedicated computer vision (CV) computation hardware and a dedicated low-power microprocessor for the purposes of detecting, tracking, recognizing, and/or analyzing subjects, objects, and scenes in the view of the camera. The vision sensor processes the information retrieved from the camera using the included low-power microprocessor and sends “events” (or indications that one or more reference occurrences have occurred, and, possibly, associated data) for the main processor only when needed or as defined and configured by the application. This allows the general-purpose microprocessor (which is typically relatively high-speed and high-power to support a variety of applications) to stay in a low-power (e.g., sleep mode) most of the time as conventional, while becoming active only when events are received from the vision sensor.

Abstract: In one aspect, an illumination device with integrated touch sensor capability includes a light guide having a metalized light-turning feature and an electrode system for sensing changes to the capacitance between electrodes in the electrode system induced by the proximity of an electrically conductive body, such as a human finger. The metalized light-turning features may be electrically connected to and/or part of the electrode system.

Abstract: This disclosure provides systems, methods and apparatus for a front illumination device with metalized light-turning features. In one aspect, an illumination device with integrated touch sensor capability includes a light guide having a metalized light-turning feature and an electrode system for sensing changes to the capacitance between electrodes in the electrode system induced by the proximity of an electrically conductive body, such as a human finger. The metalized light-turning features may be electrically connected to and/or part of the electrode system.

Abstract: Tunable MEMS resonators having adjustable resonance frequency and capable of handling large signals are described. In one exemplary design, a tunable MEMS resonator includes (i) a first part having a cavity and a post and (ii) a second part mated to the first part and including a movable layer located under the post. Each part may be covered with a metal layer on the surface facing the other part. The movable plate may be mechanically moved by a DC voltage to vary the resonance frequency of the MEMS resonator. The cavity may have a rectangular or circular shape and may be empty or filled with a dielectric material. The post may be positioned in the middle of the cavity. The movable plate may be attached to the second part (i) via an anchor and operated as a cantilever or (ii) via two anchors and operated as a bridge.

Abstract: An optical accelerometer and method of determining an acceleration are disclosed. In one aspect, an accelerometer includes a light source, a substrate, a light guide attached to a first side of the substrate and configured to redirect light from the light source through the substrate. The accelerometer also includes a light detector, a proof mass attached to a second side of the substrate via one or more springs, wherein the second side is opposite the first side and wherein motion of the proof mass alters a characteristic of the light from the light source reaching the light detector, and a processor configured to determine an acceleration based on the characteristic of the light reaching the light detector.

Abstract: This disclosure provides systems, methods and apparatus for a front illumination device with metalized light-turning features. In one aspect, an illumination device with integrated touch sensor capability includes a light guide having a metalized light-turning feature and an electrode system for sensing changes to the capacitance between electrodes in the electrode system induced by the proximity of an electrically conductive body, such as a human finger. The metalized light-turning features may be electrically connected to and/or part of the electrode system.

Abstract: This disclosure provides systems, methods and apparatus for a front illumination device with metalized light-turning features. In one aspect, an illumination device includes a light guide having light-turning features that include recesses formed on the light guide and that extend down into the light guide. The recesses may be coated with a material where the material also forms an auxiliary structure outside of the recesses on the light guide. The auxiliary structure may be conductive and may form, for example, an electrode.

Abstract: This disclosure provides systems, methods and apparatus for a front illumination device with metalized light-turning features. In one aspect, an illumination device with integrated touch sensor capability includes a light guide having a metalized light-turning feature and an electrode system for sensing changes to the capacitance between electrodes in the electrode system induced by the proximity of an electrically conductive body, such as a human finger. The metalized light-turning features may be electrically connected to and/or part of the electrode system.

Abstract: This disclosure provides systems, methods and apparatus for interposers in compact three-dimensional (3-D) device packages. In one aspect, one or more methods of fabricating an interposer using an additive process are provided. The additive process can involve depositing flowable dielectric material around a plurality of metal interconnect posts after forming the plurality of metal interconnect posts on a carrier substrate. In another aspect, an interposer including through-glass vias and one or more passive devices is provided.

Abstract: Higher capacitance density is achieved by increasing a surface area of a capacitor. A larger surface area may be obtained by forming isotropic ball shapes (a concave surface) in the trenches on the semiconductor die. The concave surfaces are fabricated by depositing bilayers of amorphous-silicon and silicon oxide. Openings are patterned in the silicon oxide hard mask for trenches. The openings are transferred to the amorphous-silicon layers through isotropic etching to form concave surfaces. Conducting, insulating, and conducting layers are deposited on the concave surfaces of the trenches by atomic layer deposition.

Abstract: MEMS varactors capable of handling large signals and/or achieving a high capacitance tuning range are described. In an exemplary design, a MEMS varactor includes (i) a first bottom plate electrically coupled to a first terminal receiving an input signal, (ii) a second bottom plate electrically coupled to a second terminal receiving a DC voltage, and (iii) a top plate formed over the first and second bottom plates and electrically coupled to a third terminal. The DC voltage causes the top plate to mechanically move and vary the capacitance observed by the input signal. In another exemplary design, a MEMS varactor includes first, second and third plates formed on over one another and electrically coupled to first, second and third terminals, respectively. First and second DC voltages may be applied to the first and third terminals, respectively. An input signal may be passed between the first and second terminals.

Abstract: This disclosure provides systems, methods and apparatus for bonding a device substrate formed of a substantially transparent material to a carrier substrate. A laser etch stop layer may be formed on the device substrate. The carrier substrate may be coated with a releasable layer, such as a polymer layer. Vias may be formed in the device substrate by laser drilling. The vias may be filled with conductive material, e.g., by electroplating or by filling the vias with a conductive paste. One or more types of devices may then be attached to the device substrate and configured for electrical communication with the vias. In some implementations, passive devices may be formed on the device substrate before the vias are formed. Before or after device fabrication, the substrates may be separated. The substrates may be separated by laser irradiation or chemical dissolution of the releasable layer.

Abstract: Higher capacitance density is achieved by increasing a surface area of a capacitor. A larger surface area may be obtained by forming isotropic ball shapes (a concave surface) in the trenches on the semiconductor die. The concave surfaces are fabricated by depositing bilayers of amorphous-silicon and silicon oxide. Openings are patterned in the silicon oxide hard mask for trenches. The openings are transferred to the amorphous-silicon layers through isotropic etching to form concave surfaces. Conducting, insulating, and conducting layers are deposited on the concave surfaces of the trenches by atomic layer deposition.

Abstract: The present invention provides a semiconductor structure including a semiconductor substrate having a plurality of source and drain diffusion regions located therein, each pair of source and drain diffusion regions are separated by a device channel. The structure further includes a first gate stack of pFET device located on top of some of the device channels, the first gate stack including a high-k gate dielectric, an insulating interlayer abutting the gate dielectric and a fully silicided metal gate electrode abutting the insulating interlayer, the insulating interlayer includes an insulating metal nitride that stabilizes threshold voltage and flatband voltage of the p-FET device to a targeted value and is one of aluminum oxynitride, boron nitride, boron oxynitride, gallium nitride, gallium oxynitride, indium nitride and indium oxynitride.