Patents by Inventor Evgeny P. Danelia

Evgeny P. Danelia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5567382
    Abstract: A dispersion strengthened copper alloy and a method for producing the alloy are provided. The alloy preferably comprises aluminum, titanium and hafnium as alloying elements that are internally oxidized under controlled conditions to produce a dispersion strengthened copper material having good hardness and high conductivity. A method for reducing the adverse effects of hydrogen on such materials is also provided. The dispersion strengthened material can be useful in many applications, including welding electrodes and electrical contacts.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: October 22, 1996
    Assignee: OTD Products L.L.C.
    Inventor: Evgeny P. Danelia
  • Patent number: 5551970
    Abstract: A dispersion strengthened copper alloy and a method for producing the alloy are provided. The alloy preferably comprises aluminum, titanium and hafnium as alloying elements that are internally oxidized under controlled conditions to produce a dispersion strengthened copper material having good hardness and high conductivity. A method for reducing the adverse effects of hydrogen on such materials is also provided. The dispersion strengthened material can be useful in many applications, including welding electrodes and electrical contacts.
    Type: Grant
    Filed: August 17, 1993
    Date of Patent: September 3, 1996
    Assignee: Otd Products L.L.C.
    Inventor: Evgeny P. Danelia
  • Patent number: 4139372
    Abstract: A copper-based alloy also contains aluminium and hafnium expressed as weight percentages:Aluminium 0.01 to 1Hafnium 0.005 to 1Copper the balance.The alloy may also contain 0.01 to 1% by weight of titanium.The proposed alloy combines high electrical conductivity which is 75 to 99% of that of copper, together with increased mechanical strength at room temperature and an ability to maintain its high strength during shorter long term exposure to temperatures.
    Type: Grant
    Filed: September 28, 1977
    Date of Patent: February 13, 1979
    Inventors: Evgeny P. Danelia, Vladimir M. Rozenberg, Vladimir I. Solopov, Jury F. Shevakin, Efim S. Shpichinetsky, Ilya S. Berin, Emmanuil Z. Yankovsky, Max A. Entin