Patents by Inventor Ewald K. M. Günther

Ewald K. M. Günther has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8916403
    Abstract: A method for producing a plurality of optoelectronic semiconductor chips includes providing a carrier wafer having a first surface and a second surface opposite the first surface, wherein a plurality of individual component layer sequences spaced apart from one another in a lateral direction are applied on the first surface, the component layer sequences being separated from one another by separation trenches; introducing at least one crystal imperfection in at least one region of the carrier wafer which at least partly overlaps a separation trench in a vertical direction; singulating the carrier wafer along the at least one crystal imperfection into individual semiconductor chips.
    Type: Grant
    Filed: February 3, 2011
    Date of Patent: December 23, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Ewald K. M. Günther, Mathias Kämpf, Jens Dennemarck, Nikolaus Gmeinwieser
  • Publication number: 20130069086
    Abstract: A method for producing a plurality of optoelectronic semiconductor chips includes providing a carrier wafer having a first surface and a second surface opposite the first surface. wherein a plurality of individual component layer sequences spaced apart from one another in a lateral direction are applied on the first surface, the component layer sequences being separated from one another by separation trenches; introducing at least one crystal imperfection in at least one region of the carrier wafer which at least partly overlaps a separation trench in a vertical direction; singulating the carrier wafer along the at least one crystal imperfection into individual semiconductor.
    Type: Application
    Filed: February 3, 2011
    Publication date: March 21, 2013
    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Ewald K. M. Günther, Mathias Kämpf, Jens Dennemarck, Nikolaus Gmeinwieser
  • Patent number: 8278767
    Abstract: An optoelectronic component includes a carrier with a mounting side and having at least one functional element, at least one substrateless optoelectronic semiconductor chip with a top and an opposed bottom and is electrically conductive by way of the top and the bottom, wherein the bottom faces the mounting side and the semiconductor chip is mounted on the mounting side, and at least one structured electrical contact film located on the top.
    Type: Grant
    Filed: August 4, 2009
    Date of Patent: October 2, 2012
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Ewald K. M. Günther, Siegfried Herrmann, Ulrich Zehnder, Herbert Brunner
  • Publication number: 20110140284
    Abstract: An optoelectronic component includes a carrier with a mounting side and having at least one functional element, at least one substrateless optoelectronic semiconductor chip with a top and an opposed bottom and is electrically conductive by way of the top and the bottom, wherein the bottom faces the mounting side and the semiconductor chip is mounted on the mounting side, and at least one structured electrical contact film located on the top.
    Type: Application
    Filed: August 4, 2009
    Publication date: June 16, 2011
    Applicant: OSRAM OPTO SEMICONDUCTORS GmbH
    Inventors: Ewald K.M. Günther, Siegfried Herrmann, Ulrich Zehnder, Herbert Brunner