Patents by Inventor Eward Martin

Eward Martin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • STRESS-RELIEF LAYERS AND STRESS-COMPENSATION COLLARS WITH LOW-TEMPERATURE SOLDERS FOR BOARD-LEVEL JOINTS, AND PROCESSES OF MAKING SAME
    Publication number: 20070190772
    Abstract: A stress-relief layer is formed by dispensing a polymer upon a substrate lower surface under conditions to partially embed a low melting-point solder bump that is disposed upon the lower surface. The stress-relief layer flows against the low melting-point solder bump. A stress-compensation collar is formed on a board to which the substrate is mated, and the stress-compensation collar partially embeds the low melting-point solder bump. An article that exhibits a stress-relief layer and a stress-compensation collar is also included. A computing system that includes the low melting-point solder, the stress-relief layer, and the stress-compensation collar is also included.
    Type: Application
    Filed: April 17, 2007
    Publication date: August 16, 2007
    Inventors: Daewoong Suh, Saikumar Jayaraman, Stephen Lehman, Mitesh Patel, Tiffany Byrne, Eward Martin, Mohd Erwan Basiron, Wei Loh, Sheau Lim, Yoong Tatt Chin