Patents by Inventor Eyal Goldberger

Eyal Goldberger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Differential on-chip loop antenna
    Patent number: 11955728
    Abstract: Aspects of the embodiments are directed to an on-chip loop antenna and methods of manufacturing the same. In some embodiments, the on-chip loop antenna is in an integrated circuit (IC) die. The IC die comprises metal loops substantially centered around a core region of the IC die in a metallization stack of the IC die, a dielectric between spaces of the metal loops, an electric circuit in the core region electrically connected to the metal loops with an interconnect, and a ground plane in the metallization stack electrically connected to the loops with a first plurality of vias and to the electric circuit with a second plurality of vias. The first plurality of vias is different from the second plurality of vias, and the electric circuit includes an inductor. In some embodiments, the on-chip loop antenna can be carried by a semiconductor package.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Nir Weisman, Omer Asaf, Eyal Goldberger
  • Wireless communication technology, apparatuses, and methods
    Patent number: 11955732
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS
    Publication number: 20230145401
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: December 27, 2022
    Publication date: May 11, 2023
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • Oscillator frequency range extension using switched inductor
    Patent number: 11552594
    Abstract: An inductive switch comprises an inductor that has a primary metallic winding having a boundary configured in shape of a figure eight, such as in two loops, and a plurality of secondary metallic windings arranged within the boundary of the primary metallic winding. The inductive switch includes a plurality of switches, each switch arranged in series with a respective one of the plurality of secondary metallic windings. An equal number of the secondary windings is arranged within each loop. A tunable inductor comprises at least one main metallic loop and at least one secondary metallic loop, wherein the at least one secondary metallic loop comprises a switch that is arranged to configure the at least one secondary metallic loop into at least one shorted metallic loop or at least one closed metallic loop. The at least one shorted loop is floating.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: January 10, 2023
    Assignee: Intel Corporation
    Inventors: Svetozar Broussev, Igor Gertman, Eyal Goldberger, Run Levinger, Ron Pongratz, Anat Rubin
  • WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS
    Publication number: 20220384956
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: May 2, 2022
    Publication date: December 1, 2022
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asi, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • Wireless communication technology, apparatuses, and methods
    Patent number: 11424539
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: August 23, 2022
    Assignee: Intel Corporation
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • Hybrid and thinned millimeter-wave antenna solutions
    Patent number: 11211688
    Abstract: Apparatuses and systems for millimeter-wave antennas are described. An apparatus comprises a board assembly, and a first and second antenna disposed within the board assembly. A third antenna can comprise a semiconductor antenna attached to the board assembly. A parasitic layer can be gap-coupled to the first and second antenna. The first and second antenna can include a rectangular patch antenna and an annular ring antenna. Other aspects are described.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: December 28, 2021
    Assignee: Intel Corporation
    Inventors: Omer Asaf, Nir Weisman, Naftali Landsberg, Eyal Goldberger, Pablo Herrero, Harry G. Skinner
  • DIFFERENTIAL ON-CHIP LOOP ANTENNA
    Publication number: 20210351511
    Abstract: Aspects of the embodiments are directed to an on-chip loop antenna and methods of manufacturing the same. In some embodiments, the on-chip loop antenna is in an integrated circuit (IC) die. The IC die comprises metal loops substantially centered around a core region of the IC die in a metallization stack of the IC die, a dielectric between spaces of the metal loops, an electric circuit in the core region electrically connected to the metal loops with an interconnect, and a ground plane in the metallization stack electrically connected to the loops with a first plurality of vias and to the electric circuit with a second plurality of vias. The first plurality of vias is different from the second plurality of vias, and the electric circuit includes an inductor. In some embodiments, the on-chip loop antenna can be carried by a semiconductor package.
    Type: Application
    Filed: July 20, 2021
    Publication date: November 11, 2021
    Applicant: Intel Corporation
    Inventors: Nir Weisman, Omer Asaf, Eyal Goldberger
  • Differential on-chip loop antenna
    Patent number: 11108156
    Abstract: Aspects of the embodiments are directed to an on-chip loop antenna and methods of manufacturing the same. The on-chip loop antenna can be carried by a semiconductor package. The semiconductor package can include a printed circuit board coupled to an integrated circuit chip. The integrated circuit chip can include a semiconductor substrate, an integrated circuit; and a loop antenna surrounding the integrated circuit. In embodiments, the semiconductor package can include a metal shield enclosing the integrated circuit chip. In embodiments, the on-chip loop antenna can be impedance matched to the impedance of the integrated circuit. In embodiments, the integrated circuit can include an antenna driver to drive the antenna differentially, the on-chip loop antenna surrounding the antenna driver.
    Type: Grant
    Filed: September 27, 2017
    Date of Patent: August 31, 2021
    Assignee: Intel Corporation
    Inventors: Nir Weisman, Omer Asaf, Eyal Goldberger
  • OSCILLATOR FREQUENCY RANGE EXTENSION USING SWITCHED INDUCTOR
    Publication number: 20200336103
    Abstract: An inductive switch comprises an inductor that has a primary metallic winding having a boundary configured in shape of a figure eight, such as in two loops, and a plurality of secondary metallic windings arranged within the boundary of the primary metallic winding. The inductive switch includes a plurality of switches, each switch arranged in series with a respective one of the plurality of secondary metallic windings. An equal number of the secondary windings is arranged within each loop. A tunable inductor comprises at least one main metallic loop and at least one secondary metallic loop, wherein the at least one secondary metallic loop comprises a switch that is arranged to configure the at least one secondary metallic loop into at least one shorted metallic loop or at least one closed metallic loop. The at least one shorted loop is floating.
    Type: Application
    Filed: March 30, 2018
    Publication date: October 22, 2020
    Inventors: Svetozar Broussev, Igor Gertman, Eyal Goldberger, Run Levinger, Ron Pongratz, Anat Rubin
  • HYBRID AND THINNED MILLIMETER-WAVE ANTENNA SOLUTIONS
    Publication number: 20200220249
    Abstract: Apparatuses and systems for millimeter-wave antennas are described. An apparatus comprises a board assembly, and a first and second antenna disposed within the board assembly. A third antenna can comprise a semiconductor antenna attached to the board assembly. A parasitic layer can be gap-coupled to the first and second antenna. The first and second antenna can include a rectangular patch antenna and an annular ring antenna. Other aspects are described.
    Type: Application
    Filed: September 28, 2018
    Publication date: July 9, 2020
    Inventors: Omer Asaf, Nir Weisman, Naftali Landsberg, Eyal Goldberger, Pablo Herrero, Harry G. Skinner
  • WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS
    Publication number: 20200091608
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: December 20, 2017
    Publication date: March 19, 2020
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • DIFFERENTIAL ON-CHIP LOOP ANTENNA
    Publication number: 20190097320
    Abstract: Aspects of the embodiments are directed to an on-chip loop antenna and methods of manufacturing the same. The on-chip loop antenna can be carried by a semiconductor package. The semiconductor package can include a printed circuit board coupled to an integrated circuit chip. The integrated circuit chip can include a semiconductor substrate, an integrated circuit; and a loop antenna surrounding the integrated circuit. In embodiments, the semiconductor package can include a metal shield enclosing the integrated circuit chip. In embodiments, the on-chip loop antenna can be impedance matched to the impedance of the integrated circuit. In embodiments, the integrated circuit can include an antenna driver to drive the antenna differentially, the on-chip loop antenna surrounding the antenna driver.
    Type: Application
    Filed: September 27, 2017
    Publication date: March 28, 2019
    Applicant: Intel Corporation
    Inventors: Nir Weisman, Omer Asaf, Eyal Goldberger
  • Current canceling gain control for high frequency wideband cross-coupled amplifiers
    Patent number: 8878610
    Abstract: An embodiment of the present invention provides a configuration of a cross-coupled common-source differential amplifier stage which enables performing a gain step down (attenuation) while maintaining good step flatness over a large relative bandwidth.
    Type: Grant
    Filed: December 27, 2012
    Date of Patent: November 4, 2014
    Assignee: Intel Corporation
    Inventors: Doron Shoham, Eyal Goldberger
  • CURRENT CANCELING GAIN CONTROL FOR HIGH FREQUENCY WIDEBAND CROSS-COUPLED AMPLIFIERS
    Publication number: 20140184329
    Abstract: An embodiment of the present invention provides a configuration of a cross-coupled common-source differential amplifier stage which enables performing a gain step down (attenuation) while maintaining good step flatness over a large relative bandwidth.
    Type: Application
    Filed: December 27, 2012
    Publication date: July 3, 2014
    Inventors: Doron Shoham, Eyal Goldberger