Abstract: Embodiments are disclosed for reduced lane utilization for an optical transceiver. An example optical transceiver apparatus includes at least one optical source and an optical connector. The at least one optical source is attached to a printed circuit board (PCB) and is configured to facilitate communication of optical signals. The PCB comprises an electrical connector electrically connected to the at least one optical source and is configured to facilitate communication of electrical signals. Furthermore, the PCB is attached to a mechanical structure. The optical connector is attached to the mechanical structure and is coupled to the at least one optical source via at least one optical fiber that facilitates transmission of the optical signals.

Abstract: A multi-chip module (MCM-10) includes a substrate (11), one or more photonic chips (14) disposed on the substrate, and an electronic chip (12) disposed on the substrate. The one or more photonic chips include one or more optical channels (22), which are configured to guide propagating optical signals, and two or more photonic modulator-segments (18) coupled to each of the optical channels, each photonic modulator-segment configured to modulate the propagating optical signals responsively to digitally modulated driving electrical signals provided thereto.

Abstract: Embodiments are disclosed for a quantum key distribution enabled intra-datacenter network. An example system includes a first vertical cavity surface emitting laser (VCSEL), a second VCSEL and a network interface controller. The first VCSEL is configured to emit a first optical signal associated with data. The second VCSEL is configured to emit a second optical signal associated with quantum key distribution (QKD). Furthermore, the network interface controller is configured to manage transmission of the first optical signal associated with the first VCSEL and the second optical signal associated with the second VCSEL via an optical communication channel coupled to a network interface module.

Abstract: Embodiments are disclosed for a quantum key distribution enabled intra-datacenter network. An example system includes a first vertical cavity surface emitting laser (VCSEL), a second VCSEL and a network interface controller. The first VCSEL is configured to emit a first optical signal associated with data. The second VCSEL is configured to emit a second optical signal associated with quantum key distribution (QKD). Furthermore, the network interface controller is configured to manage transmission of the first optical signal associated with the first VCSEL and the second optical signal associated with the second VCSEL via an optical communication channel coupled to a network interface module.

Abstract: Optical communication modules and associated methods and computer program products for performing network communication security are provided. An example optical module includes a substrate, a first optoelectronic component supported by the substrate configured for operation with optical signals having a first wavelength, and a second optoelectronic component supported by the substrate configured for operation with optical signals having a second wavelength. The module further includes an optical communication medium defining a first end in optical communication with the first optoelectronic component and the second optoelectronic component and a second end. The module also includes security circuitry operably connected with the first optoelectronic component and the second optoelectronic component. The security circuitry determines the presence of a noncompliant component coupled with the optical communication medium at the second end based upon operation of the second optoelectronic component.

Abstract: Optical communication modules and associated methods and computer program products for performing network communication security are provided. An example optical module includes a substrate, a first optoelectronic component supported by the substrate configured for operation with optical signals having a first wavelength, and a second optoelectronic component supported by the substrate configured for operation with optical signals having a second wavelength. The module further includes an optical communication medium defining a first end in optical communication with the first optoelectronic component and the second optoelectronic component and a second end. The module also includes security circuitry operably connected with the first optoelectronic component and the second optoelectronic component. The security circuitry determines the presence of a noncompliant component coupled with the optical communication medium at the second end based upon operation of the second optoelectronic component.

Abstract: Embodiments are disclosed for reduced lane utilization for an optical transceiver. An example optical transceiver apparatus includes at least one optical source and an optical connector. The at least one optical source is attached to a printed circuit board (PCB) and is configured to facilitate communication of optical signals. The PCB comprises an electrical connector electrically connected to the at least one optical source and is configured to facilitate communication of electrical signals. Furthermore, the PCB is attached to a mechanical structure. The optical connector is attached to the mechanical structure and is coupled to the at least one optical source via at least one optical fiber that facilitates transmission of the optical signals.

Abstract: A multi-chip module (MCM-10) includes a substrate (11), one or more photonic chips (14) disposed on the substrate, and an electronic chip (12) disposed on the substrate. The one or more photonic chips include one or more optical channels (22), which are configured to guide propagating optical signals, and two or more photonic modulator-segments (18) coupled to each of the optical channels, each photonic modulator-segment configured to modulate the propagating optical signals responsively to digitally modulated driving electrical signals provided thereto.

Abstract: Embodiments are disclosed for a quantum key distribution enabled intra-datacenter network. An example system includes a first vertical cavity surface emitting laser (VCSEL), a second VCSEL and a network interface controller. The first VCSEL is configured to emit a first optical signal associated with data. The second VCSEL is configured to emit a second optical signal associated with quantum key distribution (QKD). Furthermore, the network interface controller is configured to manage transmission of the first optical signal associated with the first VCSEL and the second optical signal associated with the second VCSEL via an optical communication channel coupled to a network interface module.

Abstract: An electro-optical link is provided. In an example embodiment, the electro-optical link includes a number of vertical cavity surface emitting lasers (VCSELs); one or more drivers that operate the VCSELs such that each of the VCSELs selectively emits an optical signal; one or more multiplexers that multiplex a number of optical signals into an optical fiber, each optical signal emitted by one of the VCSELs; and one or more optical fibers. At least two optical signals are multiplexed into each optical fiber of the one or more optical fibers. In some example configurations eight or sixteen optical signals are multiplexed into one optical fiber.

Abstract: A reconfigurable and redundant electro-optical connector and corresponding method are provided. The connector may include a first plurality of transducers in communication with a first port and a second plurality of transducers in communication with a second port, the first port and the first transducers defining a first channel and the second port and the second transducers defining a second channel. The connector may include a selective combiner to combine the first optical signals and the second optical signals, and a controller in communication with each of the transducers. The controller may transmit at least a first portion of a first datalink on at least the first channel in a first configuration. The controller may redistribute the first portion of the first datalink onto at least the second channel in a second configuration.

Abstract: An apparatus includes an array of electro-optical transducers, control circuitry, and a connector housing. The electro-optical transducers are configured to convert between electrical signals and respective optical signals conveyed over respective optical fibers. The control circuitry is configured, in response to a failure of a first electro-optical transducer in the array that is associated with a given optical fiber, to switch one or more of the electrical signals and the optical signals so as to replace the first electro-optical transducer with a second electro-optical transducer in the array in conveying an optical signal over the given optical fiber. The connector housing contains the array of the electro-optical transducers and the control circuitry.

Abstract: An apparatus includes a bank of optical detectors, an input optical filter and a selector. The optical detectors are configured to output respective detection indications in response to detecting a presence of an optical signal. The input optical filter is configured to receive an input optical signal having an input wavelength, and to route the input optical signal to one of the optical detectors in the bank depending on the input wavelength. The selector is configured to select an output wavelength based on the detection indications of the optical detectors, and to cause generation and transmission of an output optical signal at the selected output wavelength.

Abstract: An apparatus includes an array of electro-optical transducers, control circuitry, and a connector housing. The electro-optical transducers are configured to convert between electrical signals and respective optical signals conveyed over respective optical fibers. The control circuitry is configured, in response to a failure of a first electro-optical transducer in the array that is associated with a given optical fiber, to switch one or more of the electrical signals and the optical signals so as to replace the first electro-optical transducer with a second electro-optical transducer in the array in conveying an optical signal over the given optical fiber. The connector housing contains the array of the electro-optical transducers and the control circuitry.

Abstract: An apparatus includes a bank of optical detectors, an input optical filter and a selector. The optical detectors are configured to output respective detection indications in response to detecting a presence of an optical signal. The input optical filter is configured to receive an input optical signal having an input wavelength, and to route the input optical signal to one of the optical detectors in the bank depending on the input wavelength. The selector is configured to select an output wavelength based on the detection indications of the optical detectors, and to cause generation and transmission of an output optical signal at the selected output wavelength.

Abstract: A system for cooling an integrated circuit of an electronic device includes a cooling body and a shelf that is positioned relative to the cooling body for the device to be reversibly inserted onto the shelf so that the cooling body is in thermal contact with the integrated circuit. The cooling body is cooled by introducing a fluid therein via an input conduit. The hot fluid is received from the cooling body by an output conduit and is cooled for recycling. The housing of the electronic device includes a rearward gap that admits the cooling body into the housing of the electronic device. Preferably, further cooling is provided by forcing a gas to flow past the output conduit.

Abstract: A system for cooling an integrated circuit of an electronic device includes a cooling body and a shelf that is positioned relative to the cooling body for the device to be reversibly inserted onto the shelf so that the cooling body is in thermal contact with the integrated circuit. The cooling body is cooled by introducing a fluid therein via an input conduit. The hot fluid is received from the cooling body by an output conduit and is cooled for recycling. The housing of the electronic device includes a rearward gap that admits the cooling body into the housing of the electronic device. Preferably, further cooling is provided by forcing a gas to flow past the output conduit.

Abstract: A system for cooling an integrated circuit of an electronic device includes a cooling body and a shelf that is positioned relative to the cooling body for the device to be reversibly inserted onto the shelf so that the cooling body is in thermal contact with the integrated circuit. The cooling body is cooled by introducing a fluid therein via an input conduit. The hot fluid is received from the cooling body by an output conduit and is cooled for recycling. The housing of the electronic device includes a rearward gap that admits the cooling body into the housing of the electronic device. Preferably, further cooling is provided by forcing a gas to flow past the output conduit.

Abstract: A method includes establishing in a peripheral device at least first and second communication links with respective first and second hosts. The first communication link is presented to the first host as the only communication link with the peripheral device, and the second communication link is presented to the second host as the only communication link with the peripheral device. The first and second hosts are served simultaneously by the peripheral device over the respective first and second communication links.

Abstract: A system for cooling an integrated circuit of an electronic device includes a cooling body and a shelf that is positioned relative to the cooling body for the device to be reversibly inserted onto the shelf so that the cooling body is in thermal contact with the integrated circuit. The cooling body is cooled by introducing a fluid therein via an input conduit. The hot fluid is received from the cooling body by an output conduit and is cooled for recycling. The housing of the electronic device includes a rearward gap that admits the cooling body into the housing of the electronic device. Preferably, further cooling is provided by forcing a gas to flow past the output conduit.