Patents by Inventor Eytan Weissberger

Eytan Weissberger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for forming redundant vias between conductive layers of an integrated circuit
    Patent number: 5798937
    Abstract: A method for forming one or more redundant vias (38a-38x) around a critical via (36) involves providing an integrated circuit design file (12) containing several overlay layers. Critical vias in the file (12) are identified via a step (16). Several redundant vias are serially placed around and connected in parallel to the critical via (36), and design rules are checked for each redundant via by performing steps (24-30). Redundant vias which do not violate design rules (26) are kept in a separate redundant overlay layer and added to the design of the integrated circuit. The added redundant vias increase the yield of the integrated circuit by bolstering the integrity of critical via connections.
    Type: Grant
    Filed: September 28, 1995
    Date of Patent: August 25, 1998
    Assignee: Motorola, Inc.
    Inventors: Gabriel Bracha, Eytan Weissberger, Yehuda Volpert, Ilan Algor