Patents by Inventor Ezgi Uçar

Ezgi Uçar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250048559
    Abstract: A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.
    Type: Application
    Filed: August 8, 2024
    Publication date: February 6, 2025
    Inventors: Madison Thea MAXEY, Janett MARTINEZ, Ezgi UÇAR
  • Patent number: 12089338
    Abstract: A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: September 10, 2024
    Assignee: LOOMIA Technologies, Inc.
    Inventors: Madison Thea Maxey, Janett Martinez, Ezgi Uçar
  • Patent number: 11798891
    Abstract: A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.
    Type: Grant
    Filed: May 18, 2022
    Date of Patent: October 24, 2023
    Assignee: LOOMIA Technologies, Inc.
    Inventors: Madison Thea Maxey, Ezgi Uçar, Janett Martinez
  • Publication number: 20220278047
    Abstract: A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.
    Type: Application
    Filed: May 18, 2022
    Publication date: September 1, 2022
    Inventors: MADISON THEA MAXEY, Ezgi UÇAR, Janett Martinez
  • Patent number: 11342271
    Abstract: A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: May 24, 2022
    Assignee: Loomia Technologies, Inc.
    Inventors: Madison Thea Maxey, Ezgi Uçar, Janett Martinez
  • Publication number: 20210144858
    Abstract: A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.
    Type: Application
    Filed: January 15, 2021
    Publication date: May 13, 2021
    Inventors: Madison Thea MAXEY, Janett MARTINEZ, Ezgi UÇAR
  • Patent number: 10925168
    Abstract: A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: February 16, 2021
    Assignee: Loomia Technolgies, Inc.
    Inventors: Madison Thea Maxey, Janett Martinez, Ezgi Uçar
  • Publication number: 20200051919
    Abstract: A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.
    Type: Application
    Filed: October 18, 2019
    Publication date: February 13, 2020
    Inventors: Madison Thea Maxey, Ezgi Uçar, Janett Martinez
  • Publication number: 20190371730
    Abstract: A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.
    Type: Application
    Filed: May 31, 2018
    Publication date: December 5, 2019
    Inventors: Madison Thea MAXEY, Ezgi UÇAR, Janett MARTINEZ
  • Publication number: 20190373733
    Abstract: A mechanical subtractive method of manufacturing a flexible circuitry layer may include mechanically removing at least a portion of a conductive mesh, wherein, following the mechanical removal, a remaining portion of the conductive mesh forms at least a portion of a circuitry trace comprising an electrode; forming an electrical connection between the electrode and a terminal of an interfacing component, wherein the interfacing component comprises a connector; and encasing at least a portion of the circuit trace with an insulative layer.
    Type: Application
    Filed: May 31, 2018
    Publication date: December 5, 2019
    Inventors: Madison Thea MAXEY, Janett MARTINEZ, Ezgi UÇAR
  • Patent number: 10490507
    Abstract: A flexible circuitry layer may comprise a conductive mesh including a circuitry trace; and an interfacing component, comprising: a flexible substrate; a terminal electrically connected to the circuitry trace; and a connector configured to be detachably connected to an external device.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: November 26, 2019
    Assignee: LOOMIA Technologies, Inc.
    Inventors: Madison Thea Maxey, Ezgi Uçar, Janett Martinez
  • Publication number: 20180317597
    Abstract: A heated article comprises a circuit board; one or more batteries electrically connected to the circuit board; a flexible heating element electrically connected to the circuit board; a control switch electrically connected to the circuit board and configured to selectively adjust the heating element; and circuitry configured to charge the one or more batteries.
    Type: Application
    Filed: May 7, 2018
    Publication date: November 8, 2018
    Inventors: Madison Thea MAXEY, Ezgi Uçar, Janett Martinez