Patents by Inventor Ezio Bovio
Ezio Bovio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230347469Abstract: A polishing assembly for polishing of silicon wafers includes a polishing pad, a polishing head assembly, a temperature sensor, and a controller. The polishing head assembly holds a silicon wafer to position the silicon wafer in contact with the polishing pad. The polishing head assembly selectively varies a removal profile of the silicon wafer. The temperature sensor collects thermal data from a portion of the polishing pad. The controller is communicatively coupled to the polishing head assembly and the temperature sensor. The controller receives the thermal data from the temperature sensor and operates the polishing head assembly to selectively vary the removal profile of the silicon wafer based at least in part on the thermal data.Type: ApplicationFiled: June 1, 2023Publication date: November 2, 2023Inventors: Emanuele Corsi, Ezio Bovio
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Patent number: 11707813Abstract: A polishing assembly for polishing of silicon wafers includes a polishing pad, a polishing head assembly, a temperature sensor, and a controller. The polishing head assembly holds a silicon wafer to position the silicon wafer in contact with the polishing pad. The polishing head assembly selectively varies a removal profile of the silicon wafer. The temperature sensor collects thermal data from a portion of the polishing pad. The controller is communicatively coupled to the polishing head assembly and the temperature sensor. The controller receives the thermal data from the temperature sensor and operates the polishing head assembly to selectively vary the removal profile of the silicon wafer based at least in part on the thermal data.Type: GrantFiled: February 28, 2021Date of Patent: July 25, 2023Assignee: GlobalWafers Co., Ltd.Inventors: Emanuele Corsi, Ezio Bovio
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Publication number: 20210178547Abstract: A polishing assembly for polishing of silicon wafers includes a polishing pad, a polishing head assembly, a temperature sensor, and a controller. The polishing head assembly holds a silicon wafer to position the silicon wafer in contact with the polishing pad. The polishing head assembly selectively varies a removal profile of the silicon wafer. The temperature sensor collects thermal data from a portion of the polishing pad. The controller is communicatively coupled to the polishing head assembly and the temperature sensor. The controller receives the thermal data from the temperature sensor and operates the polishing head assembly to selectively vary the removal profile of the silicon wafer based at least in part on the thermal data.Type: ApplicationFiled: February 28, 2021Publication date: June 17, 2021Inventors: Emanuele Corsi, Ezio Bovio
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Patent number: 10960513Abstract: A polishing assembly for polishing of silicon wafers is provided. The polishing assembly includes a polishing pad, a polishing head assembly, a temperature sensor, and a controller. The polishing head assembly holds a silicon wafer to position the silicon wafer in contact with the polishing pad. The polishing head assembly selectively varies a removal profile of the silicon wafer. The temperature sensor collects thermal data from a portion of the polishing pad. The controller is communicatively coupled to the polishing head assembly and the temperature sensor. The controller receives the thermal data from the temperature sensor and operates the polishing head assembly to selectively vary the removal profile of the silicon wafer based at least in part on the thermal data.Type: GrantFiled: June 28, 2018Date of Patent: March 30, 2021Assignee: Global Wafers Co., Ltd.Inventors: Emanuele Corsi, Ezio Bovio
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Patent number: 10946493Abstract: A non-transitory computer-readable storage media having computer-executable instructions embodied thereon for operating a polishing assembly for polishing of silicon wafers is provided. When executed by at least one processor, the computer-executable instructions cause the processor to receive thermal data of a portion of a polishing pad from a temperature sensor and determine a removal profile of a silicon wafer based at least in part on the thermal data. The computer-executable instructions cause the processor to operate a polishing head assembly to position the silicon wafer in contact with the polishing pad and to selectively vary the removal profile of the silicon wafer based at least in part on the thermal data.Type: GrantFiled: June 28, 2018Date of Patent: March 16, 2021Assignee: GlobalWafers Co., Ltd.Inventors: Emanuele Corsi, Ezio Bovio
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Patent number: 10654145Abstract: A method for varying a removal profile of a silicon wafer during polishing using a polishing apparatus is provided. The polishing apparatus includes a polishing pad, a polishing head assembly configured to hold the silicon wafer, a temperature sensor, and a controller. The method includes receiving, at the controller, thermal data of a portion of the polishing pad from the temperature sensor and determining, by the controller, the removal profile of the silicon wafer based at least in part on the thermal data. The method further includes operating, by the controller, the polishing head assembly to position the silicon wafer in contact with the polishing pad and to selectively vary the removal profile of the silicon wafer based at least in part on the thermal data.Type: GrantFiled: June 23, 2016Date of Patent: May 19, 2020Assignee: GlobalWafers Co., Ltd.Inventors: Emanuele Corsi, Ezio Bovio
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Publication number: 20180304436Abstract: A polishing assembly for polishing of silicon wafers is provided. The polishing assembly includes a polishing pad, a polishing head assembly, a temperature sensor, and a controller. The polishing head assembly holds a silicon wafer to position the silicon wafer in contact with the polishing pad. The polishing head assembly selectively varies a removal profile of the silicon wafer. The temperature sensor collects thermal data from a portion of the polishing pad. The controller is communicatively coupled to the polishing head assembly and the temperature sensor. The controller receives the thermal data from the temperature sensor and operates the polishing head assembly to selectively vary the removal profile of the silicon wafer based at least in part on the thermal data.Type: ApplicationFiled: June 28, 2018Publication date: October 25, 2018Inventors: Emanuele Corsi, Ezio Bovio
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Publication number: 20180304437Abstract: A non-transitory computer-readable storage media having computer-executable instructions embodied thereon for operating a polishing assembly for polishing of silicon wafers is provided. When executed by at least one processor, the computer-executable instructions cause the processor to receive thermal data of a portion of a polishing pad from a temperature sensor and determine a removal profile of a silicon wafer based at least in part on the thermal data. The computer-executable instructions cause the processor to operate a polishing head assembly to position the silicon wafer in contact with the polishing pad and to selectively vary the removal profile of the silicon wafer based at least in part on the thermal data.Type: ApplicationFiled: June 28, 2018Publication date: October 25, 2018Inventors: Emanuele Corsi, Ezio Bovio
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Publication number: 20170001281Abstract: A method for varying a removal profile of a silicon wafer during polishing using a polishing apparatus is provided. The polishing apparatus includes a polishing pad, a polishing head assembly configured to hold the silicon wafer, a temperature sensor, and a controller. The method includes receiving, at the controller, thermal data of a portion of the polishing pad from the temperature sensor and determining, by the controller, the removal profile of the silicon wafer based at least in part on the thermal data. The method further includes operating, by the controller, the polishing head assembly to position the silicon wafer in contact with the polishing pad and to selectively vary the removal profile of the silicon wafer based at least in part on the thermal data.Type: ApplicationFiled: June 23, 2016Publication date: January 5, 2017Inventors: Emanuele Corsi, Ezio Bovio
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Publication number: 20130000672Abstract: Systems and methods are provided for cleaning an interior surface of a chemical vapor deposition reactor bell used in the production of polysilicon.Type: ApplicationFiled: June 27, 2012Publication date: January 3, 2013Applicant: MEMC ELECTRONIC MATERIALS, SPAInventors: Ezio Bovio, Paolo Molino, Diego Gava
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Patent number: 7846006Abstract: A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for controlling the dressing apparatus has pre-programmed recipes that are selectable based on the radial profile of a measured polished wafer.Type: GrantFiled: June 29, 2007Date of Patent: December 7, 2010Assignee: MEMC Electronic Materials, Inc.Inventors: Mark G. Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Maria Rinaldi, Larry Flannery
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Patent number: 7846007Abstract: A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.Type: GrantFiled: January 9, 2009Date of Patent: December 7, 2010Assignee: MEMC Electronic Materials, Inc.Inventors: Mark G. Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Maria Rinaldi, Larry Flannery
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Publication number: 20090176441Abstract: A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning apparatus is mounted adjacent the polishing pad for removing particulate and chemicals from the polishing pad. The system includes a controller for controlling the dressing apparatus and the cleaning apparatus.Type: ApplicationFiled: January 9, 2009Publication date: July 9, 2009Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Mark G. Stinson, Madhavan S. Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Maria Rinaldi, Larry Flannery
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Publication number: 20080009231Abstract: A dressing apparatus for dressing a polishing pad includes a dressing member engageable with the polishing pad. The dressing apparatus is adapted to change the amount of force exerted by the dressing member on the polishing pad as the dressing member moves radially along the polishing pad. A controller for controlling the dressing apparatus has pre-programmed recipes that are selectable based on the radial profile of a measured polished wafer.Type: ApplicationFiled: June 29, 2007Publication date: January 10, 2008Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Mark Stinson, Madhavan Esayanur, Dennis Buese, Emanuele Corsi, Ezio Bovio, Antonio Rinaldi, Larry Flannery
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Patent number: 7137874Abstract: A wafer polishing apparatus for polishing a semiconductor wafer. The polisher comprises a base (23), a turntable (27), a polishing pad (29) and a drive mechanism (45) for driven rotation of a polishing head (63). The polishing head is adapted to hold at least one wafer (35) for engaging a front surface of the wafer with a work surface of the polishing pad. A spherical bearing assembly (75) mounts the polishing head (63) on the drive mechanism for pivoting of the polishing head about a gimbal point (p) lying no higher than the work surface when the polishing head holds the wafer in engagement with the polishing pad. This pivoting allowing the plane of the front surface of the wafer to continuously align itself to equalize polishing pressure over the front surface of the wafer, while rotation of the polishing head is driven by the driving mechanism.Type: GrantFiled: November 21, 2000Date of Patent: November 21, 2006Assignee: MEMC Electronic Materials, SpAInventors: Ezio Bovio, Paride Corbellini, Marco Morganti, Giovanni Negri, Peter D. Albrecht
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Patent number: 6878302Abstract: The method comprises the steps of mounting a first wafer (13) on the mounting member (12) and securing the mounting member to the hub (16) by drawing a vacuum at a first vacuum pressure through the hub; rotating the hub about the hub axis (AH), rotating a polishing pad (34) mounted on the turntable (30) about the turntable axis (at), and bringing a surface of the wafer (13) and the polishing pad into contact with each other. The wafer (16) is demounted, and the shape of the polished wafer is determined. A second vacuum pressure is selected using the information obtained. A successive wafer is polished according to the same method as the first wafer except that the second vacuum pressure is substituted for the first vacuum pressure. The second vacuum pressure is sufficient to deform the mounting member (12) thereby deform the wafer to improve the flatness and parallelism of the surfaces of the successive wafer.Type: GrantFiled: March 30, 2000Date of Patent: April 12, 2005Assignee: MEMC Electronic Materials, SpAInventors: Paride Corbellini, Giovanni Negri, Ezio Bovio, Luca Moiraghi