Patents by Inventor Ezra HARRINGTON

Ezra HARRINGTON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240007234
    Abstract: Disclosed is die-to-die (D2D) interconnect of a component die. In an aspect, the D2D interconnect includes a transmit selection circuit, a plurality of transmit gearboxes (Tx GBXs), and a plurality of transmit D2D physical layer interfaces. The transmit selection circuit may be configured to receive at least two traffic channels and to output a data stream of at least one traffic channel to the plurality of Tx GBXs. Each of a subset of Tx GBXs may be configured to receive at least a portion of the data stream from the transmit selection circuit and to output at least the portion of the data stream to a transmit D2D physical layer interface to which the Tx GBX is communicatively coupled. Each transmit D2D physical layer interface coupled to the subset of Tx GBXs may be configured to output at least the portion of the data stream.
    Type: Application
    Filed: June 30, 2022
    Publication date: January 4, 2024
    Inventors: Ezra HARRINGTON, Stephan JOURDAN, Brian CHASE