Abstract: A two chamber immersion cooling tank for cooling at least one heat producing electronic component is described. In one sub-chamber, the at least one electronic component is appropriately secured in the tank which is filled with dielectric fluid that maintains liquid form throughout the cooling procedure. In the circulation path, prior to the component[s], is at least one cross-flow wave inducer. In the second sub-chamber is a secondary heat exchanger which is set up so that all warmed dielectric liquid leaving the electronic component[s] must flow through the secondary heat exchanger in the second sub-chamber. Flow may be vertical or horizontal with respect to the effects of gravity. If a hermetically sealed top is present, orientation can be variable and the system may be used in mobile field or vehicle applications.

Abstract: A two chamber immersion cooling tank for cooling at least one heat producing electronic component is described. In one sub-chamber, the at least one electronic component is appropriately secured in the tank which is filled with dielectric fluid that maintains liquid form throughout the cooling procedure. In the circulation path, prior to the component[s], is at least one cross-flow wave inducer. In the second sub-chamber is a secondary heat exchanger which is set up so that all warmed dielectric liquid leaving the electronic component[s] must flow through the secondary heat exchanger in the second sub-chamber. Flow may be vertical or horizontal with respect to the effects of gravity. If a hermetically sealed top is present, orientation can be variable and the system may be used in mobile field or vehicle applications.