Patents by Inventor F. Dennis Gyurina

F. Dennis Gyurina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesion primers for encapsulating epoxies
    Patent number: 4582556
    Abstract: A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.
    Type: Grant
    Filed: May 31, 1984
    Date of Patent: April 15, 1986
    Assignee: Olin Corporation
    Inventors: Sheldon H. Butt, Edward F. Smith, III, F. Dennis Gyurina
  • Adhesion primers for encapsulating epoxies
    Patent number: 4525422
    Abstract: A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.
    Type: Grant
    Filed: November 22, 1982
    Date of Patent: June 25, 1985
    Assignee: Olin Corporation
    Inventors: Sheldon H. Butt, Edward F. Smith, III, F. Dennis Gyurina
  • Casing for electronic components
    Patent number: 4521469
    Abstract: A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.
    Type: Grant
    Filed: May 31, 1984
    Date of Patent: June 4, 1985
    Assignee: Olin Corporation
    Inventors: Sheldon H. Butt, Edward F. Smith, III, F. Dennis Gyurina
  • Electrical connector material
    Patent number: 4409295
    Abstract: An electrical connector arrangement comprises a first element adapted to be in contact for substantial periods of time with a second element. The first element comprises a first metal substrate having an outer layer of a copper base alloy comprising from about 2 to about 12% aluminum, about 0.001 to about 3% silicon, and the balance essentially copper. The second element comprises a second metal substrate having a gold or gold base alloy contact surface.
    Type: Grant
    Filed: January 21, 1982
    Date of Patent: October 11, 1983
    Assignee: Olin Corporation
    Inventors: Edward F. Smith, III, F. Dennis Gyurina