Patents by Inventor F. Nihal Sinnadurai

F. Nihal Sinnadurai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tape-automated bonding of integrated circuits
    Patent number: 5223321
    Abstract: A tape for use in tape-automated-bonding of integrated circuits is disclosed. A series of interconnection arrays ("frames") are arranged along the tape, each array being formed by a number of interconnection beams 3. A terminal ("bump") 6 is located on each beam 3 for bonding to a respective interconnection pad 7 of an integrated circuit 8. Conventional bumps are made of gold-plated copper and have uneven and unyielding bonding surfaces which can fail to provide consistent bonds. The bumps 6 of the tape disclosed comprise a conductive material having a Vickers hardness number of 55 or less, and thus have a compliance which facilitates more even bonding. A method of producing the tape is also disclosed.
    Type: Grant
    Filed: October 15, 1991
    Date of Patent: June 29, 1993
    Assignee: British Telecommunications plc
    Inventors: F. Nihal Sinnadurai, David J. Small, Alexander A. Blain, Kenneth Cooper
  • Integrated circuit chip carrier
    Patent number: 4595096
    Abstract: An integrated circuit chip carrier is made of plastics material, such as glass/epoxy printed circuit board material, and comprises a base and a side wall attached to the top surface of the base to define a chip mounting cavity. Conductor tracks on the base extend from connecting pads inside the cavity to connecting points on the periphery of the carrier. The chip carrier can be fabricated as one of an array of such carriers for subsequent separation.
    Type: Grant
    Filed: December 20, 1983
    Date of Patent: June 17, 1986
    Assignee: British Telecommunications
    Inventors: F. Nihal Sinnadurai, Anthony J. Cook, Keith W. Gurnett
  • Integrated circuit chip carrier
    Patent number: 4448306
    Abstract: An integrated circuit chip carrier is made of plastics material, such as glass/epoxy printed circuit board material, and comprises a base and a side wall attached to the top surface of the base to define a chip mounting cavity. Conductor tracks on the base extend from connecting pads inside the cavity to connecting points on the periphery of the carrier. The chip carrier can be fabricated as one of an array of such carriers for subsequent separation.
    Type: Grant
    Filed: January 25, 1982
    Date of Patent: May 15, 1984
    Assignee: British Telecommunications
    Inventors: F. Nihal Sinnadurai, Anthony J. Cook, Keith W. Gurnett