Abstract: The thermal management system for in-slot cooling of electric motors includes separating structures, either in the form of a scaffolding structure or a monolithic winding structure which is placed in between the adjacent winding turns to physically separate the winding turns to define coolant fluid passages for circulation of a coolant fluid in direct contact with the lateral surfaces of the winding turns. The scaffolding and monolithic winding structures are made from an electrically insulating material and are filled with a dielectric fluid that serves both the coolant and the electrical insulator between the winding turns. An end-winding organizer may be positioned at two end regions of each stator tooth to provide a curved surface for the winding turns to be held in tension throughout the 180° winding end turns and is formed with grooves to define the passage for the coolant flow to ensure that the flowing coolant reaches the surface of the innermost winding turns.

Abstract: Methods and apparatuses for assessing the behavior of high temperature bonding systems such as sinter joint models of virtual interconnect microstructures via simulations that analyze sinter joint model properties include defining a plurality of sinter joint objects in a virtual interconnect microstructure, each sinter joint object having a type and a size, and determining a location of individual sinter joint objects with respect to one another in a virtual joint space to create a sinter joint model. The type is at least one of an intermetallic compound, a void, and a metal particle. The location is determined by, for each object, creating three-dimensional coordinates, and based on a determination that the sinter joint object is spaced from and non-overlapping with previously placed sinter joint objects, locking a position and size of the sinter joint object.

Abstract: Methods and apparatuses for controlled processing of high temperature bonding systems via devices to control heating and cooling systems of a high temperature heating bonding includes use of a sinter fixture device including a plate surface, that is shaped to contact and conform to a contacting surface of a TLPS substrate assembly, and a plurality of channels below the plate surface within a base body of the sinter fixture device shaped to receive heating and cooling elements. A first set of the one or more channels includes a plurality of cross-channels, a cooling medium inlet, and a cooling medium outlet, which cross-channels, cooling medium inlet, and cooling medium outlet are in fluid communication with one another. A second set of the one or more channels includes a plurality of heating element passageways.

Abstract: The present invention relates to transient liquid phase sinter pastes for electronic interconnects, and sinter paste application and processing methods.

Abstract: The disclosure describes soldering a first component (200) to a second component (226) for use in a downhole circuit, device and/or tool. The first component (200) includes an electrically conductive contact region (402) finished with a metallic finish layer (404). The soldering includes disposing a layer of manganese (408) adjacent to the metallic finish layer (404), and applying solder (406) to the layer of manganese (408). The solder (406) used in the soldering of the two components is a mixture of copper, silver and tin.

Abstract: Methods and apparatuses for controlled processing of high temperature bonding systems via devices to control heating and cooling systems of a high temperature heating bonding includes use of a sinter fixture device including a plate surface, that is shaped to contact and conform to a contacting surface of a TLPS substrate assembly, and a plurality of channels below the plate surface within a base body of the sinter fixture device shaped to receive heating and cooling elements. A first set of the one or more channels includes a plurality of cross-channels, a cooling medium inlet, and a cooling medium outlet, which cross-channels, cooling medium inlet, and cooling medium outlet are in fluid communication with one another. A second set of the one or more channels includes a plurality of heating element passageways.

Abstract: Methods and apparatuses for assessing the behavior of high temperature bonding systems such as sinter joint models of virtual interconnect microstructures via simulations that analyze sinter joint model properties include defining a plurality of sinter joint objects in a virtual interconnect microstructure, each sinter joint object having a type and a size, and determining a location of individual sinter joint objects with respect to one another in a virtual joint space to create a sinter joint model. The type is at least one of an intermetallic compound, a void, and a metal particle. The location is determined by, for each object, creating three-dimensional coordinates, and based on a determination that the sinter joint object is spaced from and non-overlapping with previously placed sinter joint objects, locking a position and size of the sinter joint object.

Abstract: The present invention relates to transient liquid phase sinter pastes for electronic interconnects, and sinter paste application and processing methods.

Abstract: One embodiment includes a power module. The power module includes a power switching device, at least one spot cooler and a base cooler. The at least one spot cooler and base cooler are configured to lower an average surface junction temperature and to isothermalize the surface junction temperature of the power switching device. The at least one spot cooler is embedded in at least one of a heat sink base or base cooler of the power module, and the at least one of the heat sink base or base cooler are attached onto a double side metalized substrate that is attached to the power switching device. In one embodiment, the power module further includes a trench structure cut into the double side metalized substrate.

Abstract: The disclosure describes soldering a first component (200) to a second component (226) for use in a downhole circuit, device and/or tool. The first component (200) includes an electrically conductive contact region (402) finished with a metallic finish layer (404). The soldering includes disposing a layer of manganese (408) adjacent to the metallic finish layer (404), and applying solder (406) to the layer of manganese (408). The solder (406) used in the soldering of the two components is a mixture of copper, silver and tin.

Abstract: A downhole tool conveyable within a wellbore extending into a subterranean formation, wherein the downhole tool comprises a first component, a second component, and a solder electrically and mechanically coupling the first and second components, wherein the solder comprises or consists of: from 0.001 to 1.0 weight % of copper; from 2.5 to 4.0 weight % of silver; from 0.01 to 0.25 weight % of manganese; and tin.

Abstract: One embodiment includes a power module. The power module includes a power switching device, at least one spot cooler and a base cooler. The at least one spot cooler and base cooler are configured to lower an average surface junction temperature and to isothermalize the surface junction temperature of the power switching device. The at least one spot cooler is embedded in at least one of a heat sink base or base cooler of the power module, and the at least one of the heat sink base or base cooler are attached onto a double side metalized substrate that is attached to the power switching device. In one embodiment, the power module further includes a trench structure cut into the double side metalized substrate.