Patents by Inventor Fa-Guang Shi

Fa-Guang Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9195266
    Abstract: A bonding structure includes a first connecting part, a second connecting part and an adhesive. The first connecting part includes a top surface and a first joining surface opposite to the top surface. The second connecting part includes a mounting surface and defines a bonding groove on the mounting surface, the second connecting part further includes positioning members in the bonding groove. The adhesive is received in the bonding groove of the second connecting part, then the first connecting part is received in the bonding groove. The first joining surface is supported by the positioning members to position the first connecting part, the adhesive is located between the first joining surface and a bottom of the bonding groove to join the first and the second connecting part together. The present disclosure further discloses an electronic device using the bonding structure.
    Type: Grant
    Filed: October 1, 2012
    Date of Patent: November 24, 2015
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Ju-Ping Duan, Ming-Fu Luo, Fa-Guang Shi
  • Patent number: 9004474
    Abstract: A fixing device for fixing a workpiece includes a base, a first pressing block pressing the workpiece to the base, a second pressing block, a first support member, a second support member, and a side pressing block. The workpiece includes a preprocessing portion to be machined, which has an inner surface and an outer surface, the inner and outer surfaces of the preprocessing portion are sandwiched between non-rigid materials during a machining process to avoid the generating of swarfs.
    Type: Grant
    Filed: September 28, 2011
    Date of Patent: April 14, 2015
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Zi-Ming Tang, Ming-Fu Luo, Fa-Guang Shi
  • Patent number: 8889985
    Abstract: A protective housing for an electronic device includes a main body, a protective cover, and a connecting mechanism. The protective cover is rotatably and detachably mounted to the main body by the connecting mechanism. The connecting mechanism includes a first magnetic assembly, a second magnetic assembly, and a mounting base. The first magnetic assembly is assembled within the main body, the second magnetic assembly is assembled within the mounting base. The mounting base is pivotally hinged to the protective cover, and the first magnetic assembly and the second magnetic assembly attract each other, thereby connecting the main body and the protective cover together.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: November 18, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Fa-Guang Shi, Ming-Fu Luo, Jian-Zhou Zhao, Yan Liang
  • Patent number: 8749900
    Abstract: An electronic device using a lens module is disclosed. The lens module for a housing, comprises a barrel comprising a containing portion; and at least one lens insert molded mounted in the containing portion; wherein the containing portion comprises an inner sidewall, and a first latching portion in the inner sidewall; the at least one lens comprises a main body, and a second latching portion extends outward from a side surface of the main body; the second latching portion is received in the first latching portion.
    Type: Grant
    Filed: November 22, 2011
    Date of Patent: June 10, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Ju-Ping Duan, Ming-Fu Luo, Fa-Guang Shi
  • Patent number: 8737045
    Abstract: An electronic device housing includes a bottom housing, a support frame, and a plastic side frame. The support frame is fixed on the bottom housing to form a receiving groove between the bottom housing and the plastic side frame. The plastic side frame is integrally formed by injecting a plastic material in the receiving groove. A manufacturing method for an electronic device housing is also provided.
    Type: Grant
    Filed: December 11, 2010
    Date of Patent: May 27, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Bin Dai, Fa-Guang Shi
  • Patent number: 8659497
    Abstract: A housing assembly includes an outer housing, a support member, an antenna cover, a foam member, and an adhesive member. The outer housing defines an antenna opening. The support member is positioned in the outer housing, and encloses the antenna opening. The support member defines a receiving portion for receiving an antenna module, and the receiving portion is aligned with the antenna opening. The antenna cover is positioned in the antenna opening. Both of the foam member and the adhesive member are positioned between the support member and the antenna cover, and the foam member surrounds the adhesive member. The adhesive member connects or fixes the antenna cover to the support member. A method of manufacturing the housing assembly is also provided.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: February 25, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Zi-Ming Tang, Fa-Guang Shi
  • Patent number: 8656618
    Abstract: A frame of an electronic device is a closed frame, and made of plastic material. The frame defines one or more deformation grooves at the corners of the frame to be expanded out or inwardly narrowed for changing a size of the frame. The frame includes a positioning portion and a support portion extending from an inner surface of the positioning portion. The deformation grooves are defined in the support portion.
    Type: Grant
    Filed: December 11, 2010
    Date of Patent: February 25, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Bin Dai, Fa-Guang Shi
  • Patent number: 8644032
    Abstract: An electronic device includes a housing and an installation assembly. The housing defines an opening. The installation assembly includes a fixing member and a holding member. The fixing member includes a base and a fixing portion protruding from the base. The base defines an entrance corresponding to the opening. The holding member comprising a holding portion and an engaging portion formed on an end of the holding portion. The fixing portion runs through the opening, and the base abuts against an outer surface of the housing with the entrance corresponding to the first opening. The engaging portion is engaged with the fixing portion to fix the holding member to the fixing member in the housing, and the engaging portion abuts against an inner surface of the housing, such that the installation assembly is fixed the housing surrounding the first opening.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: February 4, 2014
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Yan Liang, Bin Dai, Jing-Hua Yuan, Fa-Guang Shi, Zi-Ming Tang
  • Patent number: 8634208
    Abstract: A portable electronic device includes a housing and a chip card holding mechanism assembled within the housing. The housing defines a mounting slot and an unlocking hole adjacent to the mounting slot. The chip card holding mechanism includes a support base assembled adjacent to the mounting slot, a receiving tray and an unlocking assembly. The receiving tray is slidably mounted on the support base and includes a tray body and an operating portion formed at one end of the tray body. The operating portion has a resisting surface. The unlocking assembly includes a cam body rotatably assembled to the housing and a driving member. The cam body forms a cam resisting portion resisting against the resisting surface of the receiving tray. The driving portion is inserted into the unlocking hole for driving the cam body to rotate thereby ejecting the receiving tray.
    Type: Grant
    Filed: November 23, 2011
    Date of Patent: January 21, 2014
    Assignees: Fu Tai Hua Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Ju-Ping Duan, Ming-Fu Luo, Fa-Guang Shi
  • Publication number: 20140002972
    Abstract: A housing assembly includes a housing and a bumper insert. A jack socket hole is defined in the housing. The bumper insert is made of plastic material, and inserted in the jack socket hole to protect the jack socket hole. A connecting hole is defined through a mounting portion of the bumper insert. The disclosure also provides an electronic device using the housing assembly.
    Type: Application
    Filed: March 22, 2013
    Publication date: January 2, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: JU-PING DUAN, MING-FU LUO, FA-GUANG SHI
  • Patent number: 8605413
    Abstract: An electronic device housing includes a bottom housing, a support plate, a display panel, and a side frame. The support frame is welded in the bottom housing. The display panel is positioned on the support plate. The side frame is connected to a top edge of the bottom housing, such that the display panel is sandwiched between the support plate and the side frame. A manufacturing method for an electronic device housing is also provided.
    Type: Grant
    Filed: December 27, 2010
    Date of Patent: December 10, 2013
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Cong-Cong Wang, Zi-Ming Tang, Fa-Guang Shi, Jing-Hua Yuan
  • Patent number: 8456812
    Abstract: An electronic device housing includes a bottom housing, a support frame, a display panel, and a side frame. The bottom housing includes a base plate and four sidewalls extending from a periphery of the base plate. The support frame is welded to the sidewalls of the bottom housing. The support frame is received in the bottom housing and made up of at least two support plates, two ends of each are welded to ends of the adjacent support plates. The support frame forms at least two welding lines at joints of the at least two support plates, and each welding line corresponds to a middle portion of one sidewall. The display panel is positioned on the support frame sandwiched between the support frame and the side frame. The side frame is connected to a top edge of the bottom housing.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: June 4, 2013
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Jing-Hua Yuan, Zi-Ming Tang, Fa-Guang Shi, Cong-Cong Wang
  • Patent number: 8456817
    Abstract: A housing includes a bottom housing and a top housing. The bottom housing includes a connecting surface. The top housing includes a bottom surface. The connecting surface is fixed to the bottom surface by welding. A receiving groove is defined in the bottom surface, for receiving the molten slag generated and collected during a welding process.
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: June 4, 2013
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Zi-Ming Tang, Jing-Hui You, Fa-Guang Shi
  • Patent number: 8456824
    Abstract: A portable electronic device includes a housing and a display mounted onto the housing. The housing includes a bottom wall, a peripheral wall extending from the bottom wall, and a support wall extending from the peripheral wall, along a direction parallel to the bottom wall. The support wall has a top surface, and forms a receiving space together with the peripheral wall and the bottom wall cooperatively. The top surface of the support wall defines a receiving slot surrounding the receiving space. The display is mounted on the housing, and received within the receiving slot of the support wall, to align with the top surface of the support wall of the housing. The support wall further comprises a plurality of buffer slots defined in a bottom surface of the receiving slot and positioned at the corners of the housing.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: June 4, 2013
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Fa-Guang Shi
  • Patent number: 8441784
    Abstract: A housing includes a bottom shell, a support frame and protection blocks. The support frame is fixed on the bottom shell. The protection blocks are fixed between the bottom shell and the support frame. The support frame includes reinforcement side walls and receiving portions. The receiving portions are defined in the connecting portions of the adjoining reinforcement side walls. The protection blocks are received in the corresponding receiving portions. The bottom shell includes a bottom plate and four side plates extending from a periphery of the bottom plate. The support frame resists the four side plates.
    Type: Grant
    Filed: November 17, 2010
    Date of Patent: May 14, 2013
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Zi-Ming Tang, Fa-Guang Shi
  • Patent number: 8437131
    Abstract: An electronic device housing includes a bottom housing, a support frame, and a plastic side frame. The support frame is fixed on the bottom housing. The support frame defines a positioning groove in an edge. The plastic side frame is partially embedded in the positioning groove of the support frame. A method of manufacturing an electronic device housing is also provided.
    Type: Grant
    Filed: December 11, 2010
    Date of Patent: May 7, 2013
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Bin Dai, Fa-Guang Shi
  • Publication number: 20130108893
    Abstract: An electronic device includes a bottom housing, a heat-generating component placed on the bottom housing, and a thermoelectric cell module placed on the bottom housing and corresponding to the heat-generating component. The thermoelectric cell module includes a first thermoelectric sheet sensing a temperature of the heat-generating component, a second thermoelectric sheet sensing a temperature of the bottom housing, and a conductive member electrically connecting the first thermoelectric sheet and the second thermoelectric sheet.
    Type: Application
    Filed: February 8, 2012
    Publication date: May 2, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: FA-GUANG SHI, JIAN-ZHOU ZHAO, YAN LIANG
  • Publication number: 20130107432
    Abstract: A bonding structure includes a first connecting part, a second connecting part and an adhesive. The first connecting part includes a top surface and a first joining surface opposite to the top surface. The second connecting part includes a mounting surface and defines a bonding groove on the mounting surface, the second connecting part further includes positioning members in the bonding groove. The adhesive is received in the bonding groove of the second connecting part, then the first connecting part is received in the bonding groove. The first joining surface is supported by the positioning members to position the first connecting part, the adhesive is located between the first joining surface and a bottom of the bonding groove to join the first and the second connecting part together. The present disclosure further discloses an electronic device using the bonding structure.
    Type: Application
    Filed: October 1, 2012
    Publication date: May 2, 2013
    Inventors: JU-PING DUAN, MING-FU LUO, FA-GUANG SHI
  • Publication number: 20130084431
    Abstract: A bonding structure includes a first connecting body, an adhesive, and a second connecting body. The first connecting body has a bonding surface subject to one or more recessed grooves. The second connecting body is bonded to the bonding surface of the first connecting body by the adhesive. The bonding surface of the first connecting body defines an adhesive receiving groove, the adhesive is received in the adhesive receiving groove and bonds with the second connecting body; the adhesive receiving groove defines an initial adhesive receiving portion recessed from a bottom surface of a portion of the adhesive receiving groove; the initial adhesive receiving portion is for receiving injected adhesive, a depth of the initial adhesive receiving portion is slightly greater than that of the adhesive receiving groove to allow flow and expansion of the glue into the adhesive receiving groove when external force to bond is applied.
    Type: Application
    Filed: June 27, 2012
    Publication date: April 4, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: QI-JUN ZHAO, FA-GUANG SHI, MING-FU LUO
  • Publication number: 20130048333
    Abstract: A protective housing for an electronic device includes a main body, a protective cover, and a connecting mechanism. The protective cover is rotatably and detachably mounted to the main body by the connecting mechanism. The connecting mechanism includes a first magnetic assembly, a second magnetic assembly, and a mounting base. The first magnetic assembly is assembled within the main body, the second magnetic assembly is assembled within the mounting base. The mounting base is pivotally hinged to the protective cover, and the first magnetic assembly and the second magnetic assembly attract each other, thereby connecting the main body and the protective cover together.
    Type: Application
    Filed: April 16, 2012
    Publication date: February 28, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., FU TAI HUA INDUSTRY (SHENZHEN) CO., LTD.
    Inventors: FA-GUANG SHI, MING-FU LUO, JIAN-ZHOU ZHAO, YAN LIANG