Patents by Inventor Fa-Hsien Chang

Fa-Hsien Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Folded dual-band antenna apparatus
    Patent number: 6750821
    Abstract: A folded dual-band monopole antenna apparatus is disclosed, which includes a radiation body, a transmission line and a conductor. The radiation body resonates at a first and a second operating frequency. The radiation body connects the transmission line by way of the conductor. The radiation body includes a first side and a corresponding second side, and slits are set alternately on the first side and the second side to make the radiation body to be a meandered structure. The radiation body is folded along an extended direction of the slits to form a pillar structure for size miniaturization. The radiation body can cover a surface of a pillar dielectric material structure by printing technology for further size miniaturization and improving the strength of the radiation body.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: June 15, 2004
    Assignee: Industrial Technology Research Institute
    Inventors: Shyh-Tirng Fang, Fa-Hsien Chang, Kin-Lu Wong
  • Folded dual-band antenna apparatus
    Publication number: 20040017329
    Abstract: A folded dual-band monopole antenna apparatus is disclosed, which includes a radiation body, a transmission line and a conductor. The radiation body resonates at a first and a second operating frequency. The radiation body connects the transmission line by way of the conductor. The radiation body includes a first side and a corresponding second side, and slits are set alternately on the first side and the second side to make the radiation body to be a meandered structure. The radiation body is folded along an extended direction of the slits to form a pillar structure for size miniaturization. The radiation body can cover a surface of a pillar dielectric material structure by printing technology for further size miniaturization and improving the strength of the radiation body.
    Type: Application
    Filed: January 15, 2003
    Publication date: January 29, 2004
    Inventors: Shyh-Tirng Fang, Fa-Hsien Chang, Kin-Lu Wong