Abstract: A semiconductor device includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip includes a plurality of first conductive layers, and the second semiconductor chip is stacked to the first semiconductor chip. One of the first conductive layers includes a first local region and a second local region, the first local region has a first local metal density, the second local region has a second local metal density, and a difference between the first local metal density and the second local metal density is equal to or less than 5%.