Patents by Inventor Fa-Yin Yan

Fa-Yin Yan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7696769
    Abstract: A method of obtaining accurately a heat-dissipating requirement for electronic systems of a same kind uses a thermal analysis software, a passed thermal module with a fan, and a fan speed regulating device. The method includes steps of: (1) connecting the fan to the fan speed regulating device; (2) turning on one electronic system and running the fan, monitoring the electronic system; (3) reducing the speed of the fan until the electronic system is shut down, recording the fan speed; (4) getting a thermal resistance (Ri) of the thermal module when it runs in an open space with the fan running at the speed at which the electronic system is shut down; (5) repeating above four steps to get some Ri's of some other such electronic systems; (6) using the thermal analysis software to analyze the Ri's of the electronic systems and getting accurately the heat-dissipating requirement for the electronic systems.
    Type: Grant
    Filed: December 29, 2007
    Date of Patent: April 13, 2010
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yi-Shih Hsieh, Fa-Yin Yan
  • Publication number: 20090165990
    Abstract: A method of obtaining accurately a heat-dissipating requirement for electronic systems of a same kind uses a thermal analysis software, a passed thermal module with a fan, and a fan speed regulating device. The method includes steps of: (1) connecting the fan to the fan speed regulating device; (2) turning on one electronic system and running the fan, monitoring the electronic system; (3) reducing the speed of the fan until the electronic system is shut down, recording the fan speed; (4) getting a thermal resistance (Ri) of the thermal module when it runs in an open space with the fan running at the speed at which the electronic system is shut down; (5) repeating above four steps to get some Ri's of some other such electronic systems; (6) using the thermal analysis software to analyze the Ri's of the electronic systems and getting accurately the heat-dissipating requirement for the electronic systems.
    Type: Application
    Filed: December 29, 2007
    Publication date: July 2, 2009
    Applicants: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: YI-SHIH HSIEH, FA-YIN YAN